Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

Lohan, John; Tiilikka, P.; Rodgers, Peter; Fager, C.-M.; Rantala, Jukka

doi:10.1109/6144.868861

Cited by 30 publications

(12 citation statements)

References 14 publications

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“…The thermal map, constructed from the thermal data extraction and figure-of-merit criteria in Section II-A, together with the interactive thermal profile model, acquired from any of the two methods described in Section II-B, guides the thermal calibration of the PCB layout [8]. Component positions are then varied intuitively 4 and the thermal profile recalculated, until all components exhibit their optimal surface temperature.…”

Section: Thermal Calibrationmentioning

confidence: 99%

Thermal Design Based on Surface Temperature Mapping

Jong

Ferreira

Bauer

2005

IEEE Power Electron. Lett.

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Abstract-A method of extracting a conservative thermal model from an existing PCB assembled converter is investigated. This improves upon thermal management by increasing the thermal management contribution of the PCB itself. A thermal calibration loop is proposed in which a given converter is analyzed and data extracted, in order to create a thermal map of the surface temperature from which the component layout and thermal profiles can be estimated. Thermal figures of merit are vital to quantify the thermal adjustments, recorded in this thermal map, which are required during thermal calibration. The thermal figures of merit are also flexible enough to allow for specific optimization objectives such as high power density, or overall reliability. Two graphical means to predict temperature profiles required in the thermal calibration loop have been investigated: a thermal resistor network method with a purely analytical approach, suitable for relatively small systems where the geometry and loss analysis are simple (fewer than ten components), or a more elaborate method using a finite difference method algorithm, implemented in a spreadsheet environment. Both provide flexible means for PCB thermal layout and provide straightforward graphical visualization. A case study illustrates the complete design method.Index Terms-AC-DC power conversion, design methodology, finite difference methods, optimization methods, thermal variables control.

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Section: Thermal Calibrationmentioning

confidence: 99%

Thermal Design Based on Surface Temperature Mapping

Jong

Ferreira

Bauer

2005

IEEE Power Electron. Lett.

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“…Lohan et al analysed component heat transfer in both free convection [149] and 1 m/s airflow [225], and these analyses are extended here to both 2 and 5 m/s airflows. All analyses are undertaken using Flotherm.…”

Section: Compact Component Thermal Modelling Test Configurationsmentioning

confidence: 99%

“…Numerical models for the S 08 and PQFP 208 test configurations were previously presented by Lohan et al [149,225] and Rodgers et al [35] respectively, incorporating detailed component models. Lohan et al analysed component heat transfer in both free convection [149] and 1 m/s airflow [225], and these analyses are extended here to both 2 and 5 m/s airflows.…”

Section: Compact Component Thermal Modelling Test Configurationsmentioning

confidence: 99%

“…As this lower resolution would result in temperature averaging in regions of localised high spatial temperature gradients, this factor will be taken in consideration when comparing predictions and measurements. The infrared imaging system was calibrated to an accuracy of ±0.5°C [149]. The infrared measurements used in this study were taken for free convection.…”

Section: S 0 8 Component Configurationsmentioning

confidence: 99%

“…To correctly capture the local influence o f the copper surface traces on PCB heat spread [149], the substrate and copper tracking were modelled separately using three-dimensional conducting blocks.…”

Section: Pcb M Odellingmentioning

confidence: 99%

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An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

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The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

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