Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component

Cheng, Hsien‐Chie; Chen, Wen‐Hwa; Cheng, Hwa-Fa

doi:10.1016/j.applthermaleng.2007.04.013

Cited by 32 publications

(11 citation statements)

References 6 publications

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“…Considering the sample problem, the uncertainty in the thermal properties of silicon die, thermal interface material and copper lid are reported as 2% [33], 0.35% [31], and 3% [34], respectively. Whereas, the uncertainty in the power applied is reported as 0.2% [35] and the uncertainty in the convective heat transfer coefficient can be considered as 10% [36]. The resulting uncertainty in the measurement data considering these uncertainties can be calculated from Ref.…”

Section: Effect Of Other Uncertaintiesmentioning

confidence: 99%

Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfaces

Ertürk¹

2011

International Journal of Thermal Sciences

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Section: Effect Of Other Uncertaintiesmentioning

confidence: 99%

Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfaces

Ertürk¹

2011

International Journal of Thermal Sciences

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“…Nowadays, experimental and numerical methods have been widely used in analysis of package thermal performance [1][2][3][4]. In the numerical studies, usage of empirically determined heat transfer (HT) coefficients for the treatment of boundary conditions in conduction analysis is usually encountered [2,4].…”

Section: Introductionmentioning

confidence: 99%

“…In the numerical studies, usage of empirically determined heat transfer (HT) coefficients for the treatment of boundary conditions in conduction analysis is usually encountered [2,4]. Therefore, it would be meaningful to investigate the validity of empirical HT coefficient correlation model via the use of conjugate heat transfer model solved by well-developed methods of computational fluid dynamics (CFD).…”

Section: Introductionmentioning

confidence: 99%

CFD-based thermal characterization of board-level microelectronic devices under natural convection cooling

Hwang

Cheng

Fang

et al. 2007

2007 International Microsystems, Packaging, Assembly and Circuits Technology

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In the present paper, a systematic investigation on steady-state heat dissipation of a board-level microelectronic device under natural convection cooling is performed. For solving the conjugate solidfluid heat transfer problems, a three-dimensional computational fluid dynamics (CFD) model is developed. The effectiveness of the proposed CFD model is extensively verified through experimental validations: an existing thermal test die experiment based on Joint Electron Device Engineering Council (JEDEC) specification under a natural convection environment and a PBGA typed package is considered as test vehicle. The package is assembled to a thermal test board, which is a four-layer printed circuit board (PCB). For best controlling of the heating powers and furthermore, conducting chip junction temperature measurement, the specifically designed thermal test chip are used instead of real dice. The thermal test die measurement can derive the chip junction temperature of the assembly under various chip power dissipation rates. Based on the validated CFD model, a evaluation of empirical heat transfer correlation model is proceeded under various chip power dissipation rate. In addition, the effect of PCB structure on the thermal performance of the device under natural convection is also addressed.

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“…erefore heat transfer at micro-and nanoscales has been of great interests in the past ten years [1,2,5,[7][8][9][10][12][13][14][15]. Heat transfer in thin gas layers differs from that at large scale.…”

Section: Introductionmentioning

confidence: 99%

“…�ecause of the high heat �ux density produced by high friction between the �ying slider and the rotating disk, the anomalous heat conduction of the gas thin layer in between restricts actual improvements of storage capacity of hard disk. Additionally heat managements and performance optimizations for electronic integrated circuit chips demands as well clear understandings of heat transport mechanism of gas layers at micro-and nanoscales [7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Understanding of Thermal Conductance of Thin Gas Layers

Shan

Wang

2013

Advances in Mechanical Engineering

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We studied heat conductions in a thin gas layer at micro-and nanoscales between two straight walls by atomistic modeling. Since the Knudsen number is high while the gas may be not really rare�ed, we use the generalized Enskog-Monte-Carlo method ��EMC� for simulations. e thermal conductivity of thin gas layer is reduced signi�cantly with the decreased thickness of gas layer. We examined a few possible causes including the rare�ed gas effect and the thermal inertia effect. �ur careful simulations indicate that the temperature �ump on wall surfaces and the properties changing signi�cantly by the con�ned space are two dominating factors to the thermal conductivity reduction of thin gas layers.

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Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component

Cited by 32 publications

References 6 publications

Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfaces

Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfaces

CFD-based thermal characterization of board-level microelectronic devices under natural convection cooling

Understanding of Thermal Conductance of Thin Gas Layers

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