IEEE Trans. Device Mater. Relib.
 2014
DOI: 10.1109/tdmr.2014.2322032
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Experimental and Numerical Investigation Into the Influence of Chip-on-Film Package on Component Operating Temperature in Natural Convection

De-Shin Liu,
Zhen-Wei Zhuang,
Shu-Shen Yeh
et al.
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