2016
DOI: 10.1109/tdmr.2016.2552400
|View full text |Cite
|
Sign up to set email alerts
|

Experimental Method and Finite-Element Simulation Model for Investigation Into Flip-Chip-on-Film Inner Lead Bonding Parameters

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 16 publications
0
1
0
Order By: Relevance
“…The development of computer simulation technology can ensure accessible output characteristics (OCs) through numerical methods such as finite element, finite difference, and matrix methods. The simulation model was identified to present the influence of the MPs easily and precisely [25][26][27][28]. However, model complexities entail high computational costs.…”
Section: Introductionmentioning
confidence: 99%
“…The development of computer simulation technology can ensure accessible output characteristics (OCs) through numerical methods such as finite element, finite difference, and matrix methods. The simulation model was identified to present the influence of the MPs easily and precisely [25][26][27][28]. However, model complexities entail high computational costs.…”
Section: Introductionmentioning
confidence: 99%