2017
DOI: 10.1063/1.4990867
|View full text |Cite
|
Sign up to set email alerts
|

Examination of thermal properties and degradation of InGaN - based diode lasers by thermoreflectance spectroscopy and focused ion beam etching

Abstract: In this paper, thermal properties of InGaN-based diode lasers are investigated. The thermoreflectance technique was employed to study temperature distributions on the front facet of device. Measurements were performed, allowing investigation of the contribution of two main heat sources to the total temperature rise observed on the facet of device. It has been found that the contribution from reabsorption of laser emission at the facet, is much smaller than the one caused by Joule heating (electrical power). Ad… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
5
0

Year Published

2017
2017
2023
2023

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 7 publications
(5 citation statements)
references
References 32 publications
(35 reference statements)
0
5
0
Order By: Relevance
“…1 st -order gratings would be challenging to fabricate at the intended wavelength, as feature sizes of ~40 nm would be required for emission at ~400 nm [33] with etch depths of ~600 nm. Therefore, a 3 rd -order grating was implemented, with feature sizes of ~120 nm, and an 80% duty cycle to achieve coupling strengths comparable to that observed in a 1 st -order grating [39]. The device used was a 3 rd -order grating DFB without facet coatings, with a cavity length of 500 µm, and mounted pside up in a TO5.6 package.…”
Section: Dfb Device Structurementioning
confidence: 99%
“…1 st -order gratings would be challenging to fabricate at the intended wavelength, as feature sizes of ~40 nm would be required for emission at ~400 nm [33] with etch depths of ~600 nm. Therefore, a 3 rd -order grating was implemented, with feature sizes of ~120 nm, and an 80% duty cycle to achieve coupling strengths comparable to that observed in a 1 st -order grating [39]. The device used was a 3 rd -order grating DFB without facet coatings, with a cavity length of 500 µm, and mounted pside up in a TO5.6 package.…”
Section: Dfb Device Structurementioning
confidence: 99%
“…built-in defect. The microscopic investigation of degradation included examination of DL by means of scanning electron microscopy (SEM), as well as destructive focused ion beam (FIB) etching was applied, revealing internal defects formed within the cavity [151].…”
Section: Gan Based Diode Lasersmentioning
confidence: 99%
“…Maximum temperature increases versus pulse width registered for epitaxial layers and GaN substrate. Reproduced from [151]. CC BY 4.0.…”
Section: Acknowledgmentsmentioning
confidence: 99%
“…Methods for measurements of temperature and other thermal properties of semiconductor lasers include thermoreflectance (TR) [13][14][15][16][17], time-resolved microprobe photoluminescence (PL) [9, [18][19], scanning interferometric thermal mapping technique (SITM) [20] and techniques that use frequency shift of Fabry-Perot (FP) modes [21][22][23][24]. The first two methods use a laser source to measure light reflection intensity or photoluminescence spectrum to measure surface temperature.…”
Section: Introductionmentioning
confidence: 99%