Exaggerated Texture and Grain Growth in a Supperplastic SiAlON

Wu, Xiaohu; Chen, I‐Wei

doi:10.1111/j.1151-2916.1992.tb05497.x

Cited by 96 publications

(66 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the case of tensile stress, the c-axis oriented texture preferentially develops. Wu and Chen [112] reported that the large tensile strains at 1550 • C allow hot-pressed β-Sialon with a fine-grained microstructure at 1550 • C to develop elongated grains and a very strong c-axis oriented texture. The degree of orientation increases with increased tensile strain.…”

Section: Hot-forgingmentioning

confidence: 99%

“…Assuming a rodlike morphology for β-Si 3 N 4 grains and the absence of any interaction between neighboring grains, grain rotation models have been developed to describe the texture development in Si 3 N 4 ceramics by Wu and Chen [112] and Lee and Bowman [111]. For grain rotation under tension, Wu and Chen obtained the following equation Lee and Bowman described grain rotation under compression as follows.…”

Section: Grain Rotation Modelmentioning

confidence: 99%

See 1 more Smart Citation

Textured silicon nitride: processing and anisotropic properties

Zhu

Sakka

2008

Science and Technology of Advanced Materials

157

104

View full text Add to dashboard Cite

Textured silicon nitride (Si 3 N 4 ) has been intensively studied over the past 15 years because of its use for achieving its superthermal and mechanical properties. In this review we present the fundamental aspects of the processing and anisotropic properties of textured Si 3 N 4 , with emphasis on the anisotropic and abnormal grain growth of β-Si 3 N 4 , texture structure and texture analysis, processing methods and anisotropic properties. On the basis of the texturing mechanisms, the processing methods described in this article have been classified into two types: hot-working (HW) and templated grain growth (TGG). The HW method includes the hot-pressing, hot-forging and sinter-forging techniques, and the TGG method includes the cold-pressing, extrusion, tape-casting and strong magnetic field alignment techniques for β-Si 3 N 4 seed crystals. Each processing technique is thoroughly discussed in terms of theoretical models and experimental data, including the texturing mechanisms and the factors affecting texture development. Also, methods of synthesizing the rodlike β-Si 3 N 4 single crystals are presented. Various anisotropic properties of textured Si 3 N 4 and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact damage behavior and thermal conductivity. Models are analyzed to determine the thermal anisotropy by considering the intrinsic thermal anisotropy, degree of orientation and various microstructure factors. Textured porous Si 3 N 4 with a unique microstructure composed of oriented elongated β-Si 3 N 4 and anisotropic pores is also described for the first time, with emphasis on its unique mechanical and thermal-mechanical properties. Moreover, as an important related material, textured α-Sialon is also reviewed, because the presence of elongated α-Sialon grains allows the production of textured α-Sialon using the same methods as those used for textured β-Si 3 N 4 and β-Sialon.

show abstract

Section: Hot-forgingmentioning

confidence: 99%

Section: Grain Rotation Modelmentioning

confidence: 99%

Textured silicon nitride: processing and anisotropic properties

Zhu

Sakka

2008

Science and Technology of Advanced Materials

157

104

View full text Add to dashboard Cite

show abstract

“…A, n and p in this equation are constants [2][3][4]8,11,13,17,27,28]. According to the above-mentioned creep equation, the applied stress, the grain size of the deformed material, and the temperature affect the strain rate; namely, a fine grain is favorable for plastic deformation at a high strain rate under constant stress and temperature conditions.…”

Section: Preparation Of Fine Powdermentioning

confidence: 99%

“…These powders in some cases were used without grinding. For processes involving grinding, a process known as attrition milling was employed; however, the results of grinding, e.g., particle size or particle size distribution, were not reported [2,[4][5][6]12,13]. Another process employed for grinding is known as mechanochemical grinding [18].…”

Section: Commercial Fine Powdersmentioning

confidence: 99%

Fabrication of silicon nitride nanoceramics—Powder preparation and sintering: A review

Nishimura

Kimoto

et al. 2007

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

Fine-grained silicon nitride ceramics were investigated mainly for their high-strain-rate plasticity. The preparation and densification of fine silicon nitride powder were reviewed. Commercial sub-micrometer powder was used as raw powder in the ''as-received'' state and then used after being ground and undergoing classification operation. Chemical vapor deposition and plasma processes were used for fabricating nanopowder because a further reduction in grain size caused by grinding had limitations. More recently, nanopowder has also been obtained by high-energy milling. This process in principle is the same as conventional planetary milling. For densification, primarily hot pressing was performed, although a similar process known as spark plasma sintering (SPS) has also recently been used. One of the advantages of SPS is its high heating rate. The high heating rate is advantageous because it reduces sintering time, achieving densification without grain growth. We prepared silicon nitride nanopowder by high-energy milling and then obtained nanoceramics by densifying the nanopowder by SPS. r

show abstract

“…Furthermore, these authors showed that a number of ceramic oxide exhibit the same trend, regardless of the test temperatures and strain rates employed. Figure 2 represents the data of various kinds of ceramics, such as ceramic oxides (Y-TZP [1], Hydroxyapatite [5], PbTiO~ [7], Mn-Y-TZP [10], Y-TZP/20-80 wt.% A1203 composites [2,14], Mg-AI203 [17], fl-SiAION [19], 12Ce-CZP [211, 2Y-TZP [21], fl-Spodumene glass [22]), ceramics with covalent bonding (SiC/Si3N4 composite [13], A1203-Y203-SiC/Si3N4 composite [20]) and carbides (Fe3C/20Fe composite [8] and Fe~AICoJ10FeA1 composite [34]). The data points of 3Y-TZP and 3Y-TZP and 3Y-TZP/A1203 composites are not explicitly shown in this figure as they were shown previously in the reference [24].…”

Section: Tensile Elongation Behavior Of Superplastic Metallic Alloys mentioning

confidence: 99%

Superplasticity of fine-grained ceramics and intermetallics

Kim

1995

Metals and Materials

View full text Add to dashboard Cite

The tensile elongation of fine-grained ceramics is shown to increase as a strong function of decreasing flow stress, even though the values of strain-rate-sensitivity exponent remain high. The tensile ductility dependence on grain size was also investigated for many fine-grained ceramics either under a constant strain rate condition or a constant stress condition. The large increase of tensile ductility with the decrease of grain size under a constant strain rate, is primarily attributed to the decrease in flow stress accompanying grain size refinement. Tensile elongation behavior of some fine-grained intermetallic alloys appears similar to that typically observed in fine-grained ceramics, indicating similar failure mechanism shared by both materials.

show abstract

Exaggerated Texture and Grain Growth in a Supperplastic SiAlON

Cited by 96 publications

References 16 publications

Textured silicon nitride: processing and anisotropic properties

Textured silicon nitride: processing and anisotropic properties

Fabrication of silicon nitride nanoceramics—Powder preparation and sintering: A review

Superplasticity of fine-grained ceramics and intermetallics

Contact Info

Product

Resources

About