Evolution of Bosch Inertial Measurement Units for Consumer Electronics

Claßen, Johannes; Kult, Florian; Radović, Dušan; Zebrowski, Thomas; Jemili, Amin; Visconti, Andrea; Ezekwe, C.D.; Buhmann, Alexander; Dietrich, Manuel; Grosse, Axel; Maul, Robert; Geckeler, Carsten; Eid, Rudy

doi:10.1109/sensors47125.2020.9278815

Cited by 8 publications

(6 citation statements)

References 5 publications

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“…The works presented so far confirm that, usually, the resolution is limited by the electronics rather than the intrinsic thermomechanical Brownian noise introduced in equation (2). In addition to the already listed mechanical improvements, there are thus several examples in the literature about the design of application-specific integrated circuits (ASICs) for accelerometers.…”

Section: Electronicsmentioning

confidence: 69%

“…Such a type of process was disclosed in [37]. Offset measurements against package stress on a very large statistical set were then presented in [2,37], showing a reduction of the ZGO drift in temperature, across the consumer range, by a factor 4.…”

Section: Mechanical Offsetmentioning

confidence: 99%

“…From the design perspective, it is worth to stress in this introductory section that there are typically two resonant modes of interest in a FM accelerometer: one is related to the displacement of the main frame induced by accelerations, just like in open-loop AM accelerometer; it is not kept in oscillation, and sets thermomechanical noise as already discussed in equation (2). Its resonance frequency will be named ω 0 .…”

Section: Frequency Modulated Architecturesmentioning

confidence: 99%

“…The evolution of microelectromechanical system (MEMS) based inertial sensors [1] in the last years has seen on one side the beginning of a transition from well-consolidated consumer and automotive markets [2,3] toward other societal fields (industrial autonomous robots [4], microsatellites [5], medical equipment [6], geophysics [7]), characterized by more challenging, high-end performance. On the other side, the same consumer and automotive fields are demanding for improved performance which would enable new applications, the main drivers being short-term autonomous navigation, augmented reality, and Internet of Things.…”

Section: Introductionmentioning

confidence: 99%

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Silicon MEMS inertial sensors evolution over a quarter century

Langfelder

Bestetti

Gadola

2021

J. Micromech. Microeng.

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Silicon-based microelectromechanical systems (MEMS) inertial sensors have become ubiquitous, revolutionizing motion sensing, vibration sensing and accurate positioning in several societal fields. Driven by consumer and automotive markets, companies involved in this technological development focused mostly on low cost, miniaturization and low power consumption, somewhat sacrificing measurement accuracy. In several laboratories all over the world, however, the research toward higher-performance sensors has been going on for more than two decades, with the goal of improving two key parameters for future applications: noise density and bias stability. This review article summarizes, for silicon-based MEMS accelerometers and gyroscopes, the most relevant working principles that appeared in the scientific literature. The collection of several data about the above mentioned key figures enables tracing the roadmap for further developments in the upcoming decade.

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Section: Electronicsmentioning

confidence: 69%

Section: Mechanical Offsetmentioning

confidence: 99%

Section: Frequency Modulated Architecturesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Silicon MEMS inertial sensors evolution over a quarter century

Langfelder

Bestetti

Gadola

2021

J. Micromech. Microeng.

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“…Their moving parts are usually highly perforated due to etching steps during the manufacturing process and, more importantly, to precisely adjust damping to achieve the desired performance. State-of-the art MEMS devices exhibit therefore a complex, laterally large-scale device geometry with varying feature sizes and perforation patterns [1].…”

Section: Introductionmentioning

confidence: 99%

C6.4 - Simulation of Damping Effects in Irregularly Perforated MEMS Devices by Physical Compact Modeling

Michael¹,

Schrag²

2023

Lectures

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Accurate modeling of damping effects in high-end MEMS devices is a major challenge due to low feature sizes and complex device geometries. By applying a finite network approach with specially derived compact models, we are able to simulate structures with varying perforation patterns and account for the impact of the transition regions between differently perforated areas. Simulations of exemplary test structures with different perforation sizes and patterns prove the feasibility of our approach, which perspectively improves the accuracy of damping estimation beyond state of the art.

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