Evolution of bonding interface in solid–liquid cast-rolling bonding of Cu/Al clad strip

Huang, Huagui; Dong, Yi-kang; Yang, Meng; Du, Feng

doi:10.1016/s1003-6326(17)60119-5

Cited by 65 publications

(12 citation statements)

References 16 publications

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“…The design of Cu-Al composites has attracted strong interests since such materials can combine the excellent electrical properties of copper and the lightness and low cost of aluminum [1][2][3][4][5][6][7][8]. Among all the products available on the industrial market, Copper Clad Aluminum (CCA) wires are the most popular.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

2020

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The early stage of the reactive interdiffusion in the Cu-Al system was investigated at 350°C and 300°C thanks to in-situ transmission electron microscopy. A special care was given to find conditions where the electron beam and the sample free surface do not affect significantly the reaction. A special emphasis was then given on the influence of grain boundaries that are fast diffusion paths, and on nanoscaled particles that may interact with the transformation front. It was found that there is a transient state followed by a steady state where the mean growth rates of intermetallic compounds follow a parabolic law indicating that the kinetics is diffusion controlled. Thanks to the in-situ observations at the nanoscale, it was also possible to track the local velocity of interfaces between the different phases. Strong fluctuations were exhibited within length scales smaller than 100nm and they are partly attributed to interface pinning by nanoscaled particles. Last, considering thermodynamic and kinetic arguments, it is shown that it is mainly an indirect effect induced by a local change of solute fluxes and of concentration gradients.

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Section: Introductionmentioning

confidence: 99%

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

2020

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“…Aluminium-Copper clad sheets are widely used as electric elements such as power connectors, tapes, battery casings, condenser casings and as heat conductive elements in heat exchangers because of its higher magnetic shielding, heat conductivity, corrosion resistance, lighter weight and lower price than pure copper or copper alloys [15,16]. The research on the study of bending behaviour of Al-Cu bimetallic sheet has not been extensively studied yet.…”

Section: Introductionmentioning

confidence: 99%

Experimental study on bending behaviour of aluminium-copper clad sheets in V-bending process

Srinivasan

Raja

2019

Mechanics & Industry

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The bimetallic sheets are used in the industrial sheet metal products to meet the demands of multifunctionality. The bending behaviour of bimetallic sheet is contributed by individual layers of the sheet and it is entirely different from the monolithic material. In this study, V-bending experiments are carried out to understand the springback, bend force and thickness change of Al-Cu clad sheets. The effect of different parameters such as sheet thickness, sheet setting condition, die angle, die opening and punch radius have been investigated. The results indicated that springback is more for smaller die angle, wider die opening and larger punch radius. Increase in die angle, increase in die opening or decrease in punch radius decreases the bend force. The clad sheet thickens at Al/Cu setting condition whereas it thins at Cu/Al setting condition. This thinning or thickening of the sheet influences the springback and bend force.

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“…It has been wildly utilized in many fields, such as power, communication, architecture and aerospace [2]. And several new fabrication technologies also were proposed to further expand the production methods of Cu/Al laminated composites [3][4][5]. Meanwhile, in order to satisfy the requirements of various industrial fields, thermal mechanical machining such as hot rolling and tension are necessary.However, there is little relevant research report [6,7].…”

Section: Introductionmentioning

confidence: 99%

Effect of Deformation Temperature, Strain Rate and Strain on the Strain Hardening Exponent of Copper/Aluminum Laminated Composites

Liu

Wang

Xie

2018

Advanced Composites Letters

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In order to investigate the strain hardening behaviour of Cu/Al laminated composites, isothermal compression tests were conducted in the temperature range of 300-450 o C and stain rate range of 0.01-1 s-1. Based on the experimental data, stain hardening exponent n was calculated to evaluate the strain hardening ability of Cu/Al laminated composites during the deformation process. The results show that deformation temperature, strain rate, strain and laminated structure are all responsible for the evolution of flow stress during the isothermal compression. The highly non-linear character of Ln σ-Ln ε curves shows the dynamic competition between work hardening and dynamic softening, and dynamic softening gradually plays a dominant role with the increase of strain. Furthermore, strain hardening exponent n is more sensitive to deformation temperature than strain rate. Lower deformation temperature and higher strain rate contribute to the enhancement of strain hardening exponent n.

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Evolution of bonding interface in solid–liquid cast-rolling bonding of Cu/Al clad strip

Cited by 65 publications

References 16 publications

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

Experimental study on bending behaviour of aluminium-copper clad sheets in V-bending process

Effect of Deformation Temperature, Strain Rate and Strain on the Strain Hardening Exponent of Copper/Aluminum Laminated Composites

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