Evaporative heat transfer analysis of a micro loop heat pipe with rectangular grooves

Ghajar, M.; Darabi, J.

doi:10.1016/j.ijthermalsci.2013.12.014

Cited by 32 publications

(8 citation statements)

References 21 publications

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“…In addition to MEMS-based micro-grooved heat pipes, some other mini-or micro-scale heat pipes, such as capillary pumped loops (CPLs) [60][61][62][63][64], loop heat pipes (LHPs) [65][66][67][68][69], oscillating heat pipes (OHPs) [70][71][72][73][74][75], and vapor chambers (VCs) [76][77][78][79][80] as shown Figure 13, were also successfully constructed on silicon substrates by means of micro-fabrication technique recent years and became two-phase passive micro-coolers for electronic cooling. Similar to MEMS-based micro-grooved heat pipes, these novel MEMS-based MHPs could be considered as small versions of corresponding conventional prototypes and work at the related mechanism.…”

Section: Other Emerging Mems-based Mhpsmentioning

confidence: 99%

MEMS-Based Micro-heat Pipes

Qu¹,

Wang²

2016

Electronics Cooling

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Micro-electro-mechanical systems (MEMS)-based micro-heat pipes, as a novel heat pipe technology, is considered as one of the most promising options for thermal control applications in microelectronic circuits packaging, concentrated solar cells, infrared detectors, micro-fuel cells, etc. The operating principles, heat transfer characteristics, and fabrication process of MEMS-based micro-grooved heat pipes are firstly introduced and the state-of-the-art of research both experimental and theoretical is thoroughly reviewed. Then, other emerging MEMS-based micro-heat pipes, such as micro-capillary pumped loop, micro-loop heat pipe, micro-oscillating heat pipe, and micro-vapor chamber are briefly reviewed as well. Finally, some promising and innovatory applications of the MEMS-based micro-heat pipes are reported. This chapter is expected to provide basic reference for future researches.

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Section: Other Emerging Mems-based Mhpsmentioning

confidence: 99%

MEMS-Based Micro-heat Pipes

Qu¹,

Wang²

2016

Electronics Cooling

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“…In most cases, such high heat fluxes cannot be easily dissipated using existing cooling techniques, directly affecting the performance, cost, and reliability of devices (Wang, Yao, Shi, Wu, & Zhang, 2018). Heat pipes may be a good alternative for such applications (Ghajar & Darabi, 2014). According to Faghri (2014), heat pipes are highly effective passive devices for transmitting heat at high rates over considerable distances with small temperature decrease, flexibility, simple construction, and easy control with no external pumping power.…”

Section: Introductionmentioning

confidence: 99%

Experimental research of capillary structure technologies for heat pipes

et al. 2020

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This paper presents an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging. The first capillary structure is that of axial grooves manufactured by wire electrical discharge machining (wire-EDM). The sintering process with copper powder produced the second heat pipe. Finally, a hybrid heat pipe was made by the combination of the two previous methods. The heat pipes were produced using copper tubes with an outer diameter of 9.45 mm and a length of 200 mm, and were tested horizontally at increasing heat loads varying from 5 to 35 W. The working fluid used was distilled water. The experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable. Nonetheless, the hybrid heat pipe is the best, due to the lowest thermal resistance presented.

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“…The failure factor of the electronic devices resulting from electromigration and oxide breakdown, in general, increase almost exponentially with the working temperature that should not exceed a value between 85 °C and 100 °C [2]. Limiting the maximum operating temperature has resulted in an increase of packaging complexity, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices [3]. Thus, the thermal management of electronic packaging has be---------------come a key technique in many applications [4].…”

Section: Introductionmentioning

confidence: 99%

Thermal performance evaluation of different passive devices for electronics cooling

Krambeck¹,

Baptista²,

Marrone³

et al. 2019

THERM SCI

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The advent of modern electronic technology lead to miniaturization and high power density of electronic devices, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices. Thus, the thermal management of electronic packaging has become a key technique in many products. Passive heat transfer devices can be a good alternative to the stabilization of electronic devices temperature. In this research, an experimental evaluation of the thermal performance of four different passive devices was accomplished. The considered devices were a rod, a thermosyphon, a heat pipe with a metal screen as the capillary structure, and a heat pipe with microgrooves. The heat pipe is a highly efficient device that carries large amounts of power with a small temperature difference. The heat pipe consists of the involucre, the working fluid, and the capillary structure. The thermosyphon is a kind of heat pipe assisted by gravity. In other words, it has no wick structure to return the working fluid. The devices were made of copper with a total length of 200 mm and an outer diameter of 9.45 mm. The thermosyphon and the heat pipes used deionized water as working fluid with a filling ratio of 60% of the evaporator volume. The devices were tested in vertical and horizontal positions under thermal loads between 5 W and 45 W. All the devices have operated satisfactorily when tested in accordance with the behavior of the thermal resistance. The heat pipes were the best among the tested devices and the best position was vertical.

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Evaporative heat transfer analysis of a micro loop heat pipe with rectangular grooves

Cited by 32 publications

References 21 publications

MEMS-Based Micro-heat Pipes

MEMS-Based Micro-heat Pipes

Experimental research of capillary structure technologies for heat pipes

Thermal performance evaluation of different passive devices for electronics cooling

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