2009
DOI: 10.1016/j.mee.2009.01.026
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Evaporating characteristics of sessile droplet on hydrophobic and hydrophilic surfaces

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Cited by 141 publications
(91 citation statements)
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“…Lower contact angles resulted in a higher evaporation rate. 25 The dimensionless contact angle of the hydrophobic (plain copper) surface (h 0 phobic ) had a slightly higher value and shorter time (23 s) than did others when h 0 phobic reached 0.7. Fluctuating values were observed after 23 s, caused by the large amount of vapor bubble expansion and contraction inside the droplet.…”
mentioning
confidence: 88%
See 1 more Smart Citation
“…Lower contact angles resulted in a higher evaporation rate. 25 The dimensionless contact angle of the hydrophobic (plain copper) surface (h 0 phobic ) had a slightly higher value and shorter time (23 s) than did others when h 0 phobic reached 0.7. Fluctuating values were observed after 23 s, caused by the large amount of vapor bubble expansion and contraction inside the droplet.…”
mentioning
confidence: 88%
“…10,18,[20][21][22] Occasionally, evaporation begins in the CCR mode until the droplet reaches the receding contact angle, at which time it transitions to the CCA mode. 18,23,24 Recently, the effect of surface wettability on evaporation has been investigated extensively: hydrophilic surfaces and hydrophobic surfaces, 10,11,18,20,[25][26][27][28] and more specifically, superhydrophilic and superhydrophobic situations 10,18,20,[28][29][30][31][32][33] have been explored. Kulinich and Farzaneh 30 observed that water droplets evaporated rapidly on a surface with high contact angle hysteresis (CAH).…”
mentioning
confidence: 99%
“…The influence of the retraction of the contact line during drying is addressed for two limiting drying modes [1]: the constant contact angle mode, in which the droplet radius decreases with time and the contact angle remains fixed, and the constant contact area mode, wherein the contact line is pinned throughout drying. The former mode occurs on substrates with low contact angle hysteresis and is often observed on hydrophobic substrates [2]. Contact line pinning is enhanced by surface roughness, chemical heterogeneities, or particles inside the droplet.…”
Section: Introductionmentioning
confidence: 99%
“…In such technologies, the evaporation rate is a key contributor to the overall system efficiency -as it dictates the droplet lifetime and corresponding rates of heat and mass transfer. With this said, a droplet's evaporation rate ( _ m LG ) is commonly correlated with several interdependent factors/parameters, including contact line dynamics/motion [7,[13][14][15][16]; substrate surface structure [17], energy [18], and thermal conductivity [19]; vapor/gas concentration and convection [20,21]; and the thermofluid properties of the evaporating fluid itself [22]. Thus, from an overarching perspective, droplet evaporation can be considered a relatively complex phenomena.…”
Section: Introductionmentioning
confidence: 99%