Evaluation of the Microstructures of CSP Microjoints with Sn-Ag Lead-Free Solders.

Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints

“…[2] Since the joints are formed with solder balls, many studies of the reliability of the joints made with lead-free solder balls have been performed. [3][4][5][6][7][8][9][10][11][12][13] In most of these studies, the joint strength of the solder ball joint was examined at lower shear speeds using a ball shear tool. Since the increasing popularity of mobile products has made the impact reliability of the solder ball joint a critical issue, [14] impact tests have been used to examine the impact strength of solder ball joints at higher shear speeds.…”