Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints

Shohji, Ikuo; Shimoyama, Satoshi; Ishikawa, Hisao; Kojima, Masao

doi:10.5104/jiepeng.1.9

Cited by 4 publications

(3 citation statements)

References 25 publications

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“…2b, c ). Similar trends were observed in previous studies 48 , 63 – 66 and can be assigned to viscoelastic properties of PMMA 67 – 70 . We chose a shear speed of 10 µm s −1 for the experiments with 2D materials to prevent a significant influence of the viscoelastic properties of PMMA.…”

Section: Resultssupporting

confidence: 91%

“…The influence of the shear speed was evaluated on samples with PMMA on thermal SiO 2 because shear speed effects strongly influence τ C 31 , 35 , 48 . τ C at low shear speeds below 5 µm s −1 was significantly lower than at high shear speeds (Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Here, we introduce button shear testing as a quantitative method for determining the shear strengths of 2D materials. Button shear testing is an established method for adhesion measurements in typical semiconductor technologies and materials 43 – 48 , which yields rapid and conclusive results based on vast existing knowledge. We demonstrate the feasibility of the method for different 2D materials and substrate combinations and its application in evaluating the effect of sample treatments on adhesion.…”

Section: Introductionmentioning

confidence: 99%

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Button shear testing for adhesion measurements of 2D materials

Schätz,

Nayi,

Weber

et al. 2024

Nat Commun

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Two-dimensional (2D) materials are considered for numerous applications in microelectronics, although several challenges remain when integrating them into functional devices. Weak adhesion is one of them, caused by their chemical inertness. Quantifying the adhesion of 2D materials on three-dimensional surfaces is, therefore, an essential step toward reliable 2D device integration. To this end, button shear testing is proposed and demonstrated as a method for evaluating the adhesion of 2D materials with the examples of graphene, hexagonal boron nitride (hBN), molybdenum disulfide, and tungsten diselenide on silicon dioxide and silicon nitride substrates. We propose a fabrication process flow for polymer buttons on the 2D materials and establish suitable button dimensions and testing shear speeds. We show with our quantitative data that low substrate roughness and oxygen plasma treatments on the substrates before 2D material transfer result in higher shear strengths. Thermal annealing increases the adhesion of hBN on silicon dioxide and correlates with the thermal interface resistance between these materials. This establishes button shear testing as a reliable and repeatable method for quantifying the adhesion of 2D materials.

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