Evaluation of the growth behaviour of gold film surfaces evaporation-deposited on mica under different conditions

Liu, Zhi Hui; Brown, N. M. D.; McKinley, A

doi:10.1088/0953-8984/9/1/009

Cited by 43 publications

(31 citation statements)

References 35 publications

(50 reference statements)

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“…Previous work has also shown that single atoms are very mobile over the sur- face but growth can still nucleate without the need of a seed point (such as a surface defect) to which the mobile atoms can stick. 33 We also find that both single Ag atoms and Ag dimers are very mobile on the surface with energy barriers for diffusion of 0.12 eV and 0.22 eV, respectively. Surface trimers are also mobile and are found to diffuse as a unit with an energy barriers of 0.28 eV.…”

Section: A Deposition Of Silver Atoms On Silver Surfacesmentioning

confidence: 60%

Atomistic surface erosion and thin film growth modelled over realistic time scales

Scott¹,

Blackwell²,

Vernon³

et al. 2011

The Journal of Chemical Physics

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We present results of atomistic modelling of surface growth and sputtering using a multi-time scale molecular dynamics–on-the-fly kinetic Monte Carlo scheme which allows simulations to be carried out over realistic experimental times. The method uses molecular dynamics to model the fast processes and then calculates the diffusion barriers for the slow processes on-the-fly, without any preconceptions about what transitions might occur. The method is applied to the growth of metal and oxide materials at impact energies typical for both vapour deposition and magnetron sputtering. The method can be used to explain growth processes, such as the filling of vacancies and the formation of stacking faults. By tuning the variable experimental parameters on the computer, a parameter set for optimum crystalline growth can be determined. The method can also be used to model sputtering where the particle interactions with the surface occur at a higher energy. It is shown how a steady state can arise in which interstitial clusters are continuously being formed below the surface during an atom impact event which also recombine or diffuse to the surface between impact events. For fcc metals the near surface region remains basically crystalline during the erosion process with a pitted topography which soon attains a steady state roughness.

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Section: A Deposition Of Silver Atoms On Silver Surfacesmentioning

confidence: 60%

Atomistic surface erosion and thin film growth modelled over realistic time scales

Scott¹,

Blackwell²,

Vernon³

et al. 2011

The Journal of Chemical Physics

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“…Alternatively, thermal annealing can enhance the flatness of the substrate and can markedly improve the grain size, reduce surface contamination, and afford highly oriented single crystal-like films 16 , without the need for heating during deposition. Annealing temperature and time seems not to contribute significantly to surface roughness when compared to other deposition factors 12,16,18 . However, annealing or heating of the substrate is not always feasible as it can lead to the generation of undesired stresses in the MEMS/NEMS device.…”

Section: Introductionmentioning

confidence: 81%

“…Studies showed that a deposition rate of less than 1 nm s -1 gives a smoother surface 14 , the chamber pressure (<10 -5 Torr) is insignificant compared to other factors 14,15 , the thickness of evaporated gold film has an effect on the size of the island, and [111] plateaus, with lateral dimensions in the range of 200 to 300 nm, occur for film thicknesses greater than 100 nm 17 . Moreover, studies reveal that the substrate temperature during deposition has a great influence on flatness and size of deposited gold grains 12,14,15,18,19 . By increasing the substrate temperature during deposition, adatoms and surface atoms are in a higher energy state compared to unheated substrate 18 .…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, studies reveal that the substrate temperature during deposition has a great influence on flatness and size of deposited gold grains 12,14,15,18,19 . By increasing the substrate temperature during deposition, adatoms and surface atoms are in a higher energy state compared to unheated substrate 18 . Therefore, at elevated temperatures sufficient activation energy for adatoms is provided and this enables them to travel longer distances to form a large smooth and continuous plateau, and hence, epitaxy can be enhanced.…”

Section: Introductionmentioning

confidence: 99%

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Room temperature thermally evaporated thin Au film on Si suitable for application of thiol self-assembled monolayers in micro/nano-electro-mechanical-systems sensors

Mahmoodi

Rushdi

Bowen

et al. 2017

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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Gold is a standard surface for attachment of thiol-based self-assembled monolayers (SAMs). To achieve uniform defect free SAM coatings, which are essential for bio/chemical sensing applications, the gold surface must have low roughness, and be highly orientated. These requirements are normally achieved by either heating during Au deposition or post deposition Au surface annealing. This paper shows that room temperature deposited gold, can afford equivalent gold surfaces, if the gold deposition parameters are carefully controlled. This observation is an important result as heating (or annealing) of the deposited gold can have a detrimental effect on the mechanical properties of the silicon on which the gold is deposited used in microsensors. The paper presents the investigation of the morphology and crystalline structure of Au film prepared by thermal evaporation at room temperature on silicon. The effect of gold deposition rate is studied, and it is shown that by increasing the deposition rate from 0.02 nm s -1 to 0.14 nm s -1 the gold surface RMS roughness decreases, whereas the grain size of the deposited gold is seen to follow a step function decreasing suddenly between 0.06 and 0.10 nm s -1 . The XRD intensity of the preferentially [111] orientated gold crystallites is also seen to increase as the deposition rate increases up to a deposition rate of 0.14 nm s -1 . Formation and characterization of 1-dodecanethiol on these Au coated samples is also studied using contact angle. It is shown that by increasing the Au deposition rate the contact angle hysteresis (CAH) decreases until it plateaus, for a deposition rate greater than 0.14 nm s -1 , where the CAH is smaller than 9 degrees which is an indication of homogeneous SAM formation, on a smooth surface. 2

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“…12,13 This hypothesis was based on the analysis of X-ray diffraction data and surface roughness data recorded with a scanning tunneling microscope (STM) on some metallic films. Measurements of the roughness of the surface of gold films evaporated onto mica substrates employing an atomic force microscope (AFM), 14 and of the roughness of gold films evaporated onto glass substrates performed with an STM 15,16 confirmed this assumption in the case of gold films. This may have stimulated theoretical efforts that gave rise to two theories that predict the increase in resistivity arising from electron-scattering by a rough fractal surface.…”

Section: Introductionmentioning

confidence: 88%

Resistivity of thin gold films on mica induced by electron-surface scattering from a self-affine fractal surface

Muñoz

González-Fuentes

Henríquez

et al. 2011

Journal of Applied Physics

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We present a rigorous comparison between resistivity data and theoretical predictions involving the theory of Palasantzas [G. Palasantzas and J. Barnas, Phys. Rev. B 56, 7726 (1997)], and the modified Sheng, Xing, and Wang-fractal theory [R. C. Munoz et al., Phys. Rev. B 66, 205401 (2002)], regarding the resistivity arising from electron scattering by a self-affine fractal surface on gold films using no adjustable parameters. We find that both theories lead to an approximate description of the temperature dependence of the resistivity data. However, the description of charge transport based upon fractal scaling seems oversimplified, and the predicted increase in resistivity arising from electron-surface scattering seems at variance with other experimental results. If the samples are made up of grains such that the mean grain diameter D > ℓ0(300), the electronic mean free path in the bulk at 300 K, then the predicted increase in resistivity at 4 K is of the order of a few percent. This contradicts published measurements of magnetomorphic effects arising from size effects where electron-surface scattering is the dominant electron scattering mechanism at 4 K. On the contrary, if the samples are made out of grains such that D < ℓ0(300), then the dominant electron scattering mechanism controlling the resistivity is not electron-surface scattering but rather electron-grain boundary scattering, and the latter electron scattering mechanism is not included in either theory.

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Evaluation of the growth behaviour of gold film surfaces evaporation-deposited on mica under different conditions

Cited by 43 publications

References 35 publications

Atomistic surface erosion and thin film growth modelled over realistic time scales

Atomistic surface erosion and thin film growth modelled over realistic time scales

Room temperature thermally evaporated thin Au film on Si suitable for application of thiol self-assembled monolayers in micro/nano-electro-mechanical-systems sensors

Resistivity of thin gold films on mica induced by electron-surface scattering from a self-affine fractal surface

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