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2017
DOI: 10.1116/1.4990026
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Room temperature thermally evaporated thin Au film on Si suitable for application of thiol self-assembled monolayers in micro/nano-electro-mechanical-systems sensors

Abstract: Gold is a standard surface for attachment of thiol-based self-assembled monolayers (SAMs). To achieve uniform defect free SAM coatings, which are essential for bio/chemical sensing applications, the gold surface must have low roughness, and be highly orientated. These requirements are normally achieved by either heating during Au deposition or post deposition Au surface annealing. This paper shows that room temperature deposited gold, can afford equivalent gold surfaces, if the gold deposition parameters are c… Show more

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Cited by 19 publications
(14 citation statements)
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“…Figure 5 shows an increase in the average crystallite size D with deposition rate for copper films with and without graphene. These results are consistent with those obtained in previous works for Au films on Si [62,63]. However, the crystallite sizes show the same dependencies on the deposition rate for both types of copper films, and therefore, the sheet resistance and FOM of copper films deposited on graphene at low rates are primarily defined by the presence of voids in percolated films.…”
Section: Resultssupporting
confidence: 92%
“…Figure 5 shows an increase in the average crystallite size D with deposition rate for copper films with and without graphene. These results are consistent with those obtained in previous works for Au films on Si [62,63]. However, the crystallite sizes show the same dependencies on the deposition rate for both types of copper films, and therefore, the sheet resistance and FOM of copper films deposited on graphene at low rates are primarily defined by the presence of voids in percolated films.…”
Section: Resultssupporting
confidence: 92%
“…However, high surface roughness can result in increased fouling properties [ 22 , 25 , 26 ]. Planar electrodes such as evaporated gold on glass or silicon substrates benefit from the smoothness of their respective substrates, leading to controllable smooth surfaces [ 27 ]. Although some applications utilise planar gold electrodes, a low-cost alternative solution predominantly includes screen-printed electrodes, which are known to possess very high surface roughness, due to the nature of their production [ 21 , 23 ].…”
Section: Resultsmentioning
confidence: 99%
“…Titanium (Ti) was used to increase the adhesion between Au layer and the trench. [58] Ti was deposited at a deposition rate of 0.1 nm s −1 with a thickness of 5.0 nm. Then, Au was evaporated at a rate of 0.1 nm s −1 with a thickness of 35.0 nm.…”
Section: Methodsmentioning
confidence: 99%