Evaluation of the deformation fields and bond integrity of Cu/SS joints

Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel

“…The temperature stability was monitored throughout using a thermocouple consisting of copper and constantan wires percussion welded to the surface of the test piece. 4. ANALYSIS Three-dimensional nonlinear elastic-plastic FEA of the deformation behavior in the cracked and uncracked specimens was carried out using the commercial software MARC 2001.…”

“…The interface strength is usually less than the ultimate tensile strength of the base materials, and failure typically occurs at the interface with varying amounts of material being detached on both sides [2,3]. This has been attributed to the existence of voids near the HIP interface [3] and the difference in the elastic moduli of the materials, which is responsible for shear stresses at the interface on loading [4,5].…”

Effects of particle size, particle volume fraction and matrix composition on the fatigue crack growth resistance of Al alloy/Al alloy + SiCp bimaterials

“…The interface bonding strength will also play an important role in how the crack will behave as it approaches the interface, since low bonding interface strength can result in crack growth along the interface or delamination, adding additional complexities to the analysis [18][19][20][21][22]. In the present bimaterial systems, the existence of a strong interface bonding [23][24][25][26] facilitates understanding such systems.…”

Fracture toughness of selectively reinforced Al2124 alloy: Precrack tip in the composite side

“…[15] Low interface bonding strength can result in crack growth along the interface or delamination, adding additional complexities to the analysis. [16][17][18][19][20] In the present bimaterial systems, the existence of strong interface bonding facilitates the investigation of such systems. [21][22][23][24][25] In the Al alloy/Al alloy ϩ SiC bimaterials (noting that both ys and E of the composite are increased, and ␣ is decreased, compared with the Al alloy), if the crack is in the composite side and close to the interface, the elastic/plastic mismatch is expected to increase K, while the near tip compressive residual stress is expected to have the opposite effect.…”