Evaluation of Temperature for an Electronic Enclosure

Abstract

The evaluation of temperature for a typical electronic package used in the spacecraft industry has been verified using a lumped modeling methodology including radiation exchange calculation. Electronic enclosure packages constitute various heat dissipating elements mounted on the layered circuit board. The protection of components from thermal damages requires, that can be done by the careful selection of layouts, the dissipation levels which affects the circuit board and various used thermal control methods. ITAS refers to the integrated thermal analysis simulation available in the ISAC for calculation of radiation exchange factor internally, uses Gebhart technique and Monte Carlo Simulation technique. Package level simulation has been done to evaluate the temperature of electronic enclosure and results validated. Results of these thermal analysis are compared with the results given by thermovac tests conducted at ISAC. Under typical operating environmental condition and considerations of conduction and radiation heat transfer modes, temperature levels of the PCB and Components were improved. Based on this thermal analysis variance results suggestions have given to improve the thermal performance of the electronic enclosure packages.