Evaluation of surface and sub-surface cracks of ground ceramic

Subsurface damage induced in dental resurfacing of a feldspar porcelain with coarse diamond burs

“…This indicates that selections of suitable depths of cut and feed rates are both important because severe subsurface damage can result from high depths of cut or feed rate. This finding is also consistent with studies on machining-induced damage in diamond grinding of engineering ceramics (Yui et al, 1989;Maksoud et al, 1999). In addition, both predicted and measured subsurface damage depths increased approximately linearly with the diamond grit depth of cut.…”

Investigation of grinding modes in horizontal surface grinding of optical glass BK7

“…Since the depth of median cracking is commonly greater than that of lateral cracking as suggested by Maksoud et al (1999), subsurface cracking might exist beneath the ground surface even when Eq. (13) is satisfied.…”

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

“…The major form of machining damage usually occurs as surface and subsurface damage. The first type of damage is due to radial cracks formed on the ground surface which are visible, and the later damage is due to median and lateral cracks that are formed below the affected grinding zone which are not visible [1]. The nature of the grinding damage depends on the mechanism of material removal.…”