Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

Agarwal, Sanjay; Rao, P. Venkateswara

doi:10.1016/j.ijmachtools.2007.10.013

Cited by 265 publications

(104 citation statements)

References 32 publications

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“…Specific to silicon carbide ceramics, Agarwal et al [18] conducted a high machining rate grinding experiments to study the surface/ subsurface damage formation and material removal mechanism. It was found that individual grains dislodgement act as the primary removal mode due to micro cracks propagation along the grain boundaries.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhang

et al. 2017

Int J Adv Manuf Technol

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Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultraprecision grinding experiments were performed on reactionbonded silicon carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy, and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plow stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary, and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins, and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high-resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane, i.e., (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins were discussed, and a schematic model was proposed to clarify the relationship between plastic deformation-induced defects and brittle fractures.

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Section: Introductionmentioning

confidence: 99%

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhang

et al. 2017

Int J Adv Manuf Technol

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“…Vitrified bond was used because resin bond is unable to hold very fine diamond abrasives. The error of wheel deformation caused by the use of different bond materials was assumed to be insignificant as the three wheels had similar hardness values A c c e p t e d M a n u s c r i p t 6 and the same geometries (which are consisted of an abrasive layer of 2 mm thick and an aluminium core of 176 mm in diameter) [15]. A conventional wheel speed of 40 m/s and two high-speeds of 80 m/s and 120 m/s were used to examine the effect of wheel speed.…”

Section: Grinding Proceduresmentioning

confidence: 99%

A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure

Kang

Huang

2017

Precision Engineering

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Please cite this article as: Kang C, Huang H, A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure, Precision Engineering (2017), http://dx.doi.org/10. 1016/j.precisioneng.2017.05.010 This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.

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“…Thus, certain assumptions have to be made while predicting the surface roughness. The assumptions are as follows: (1) The profile of the grooves generated is same and completely defined by the depth of engagement or undeformed chip thickness 't' (2) There is no groove overlapping (3) An individual grain has many tiny cutting points in its surface, therefore, for simplicity, the grains are approximated as uniform spheres of diameter d g (=2t), randomly distributed throughout the wheel volume. On the average, the expected value of an interference area through a sphere is about one fourth of the area of a circle.…”

Section: Model Developmentmentioning

confidence: 99%

“…Advanced engineering materials have been extensively used in industrial applications during the last two decades [1,2]. However, the actual utilization of advanced materials with high strength and hardness has been quite limited mainly because of the machining difficulties and associated high cost of machining these materials by grinding whilst ensuring the workpiece quality.…”

Section: Introductionmentioning

confidence: 99%

Surface Roughness Prediction in Grinding: a Probabilistic Approach

Saxena

Agarwal²,

Das

2016

MATEC Web Conf.

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Abstract. Surface quality of machined components is one of the most important criteria for the assessment of grinding processes. The importance of surface finish of a product depends upon its functional requirements. Since surface finish is governed by many factors, its experimental determination is laborious and time consuming. So the establishment of a model for the reliable prediction of surface roughness is still a key problem for grinding. In this study, a new analytical surface roughness model is developed on the basis of the stochastic nature of grinding processes. The model is governed mainly by the random geometry and the random distribution of cutting edges on the wheel surface having random grain protrusion heights. A simple relationship between the surface roughness and the chip thickness was obtained, which was validated by the experimental results using AISI 4340 steel in surface grinding.

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Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

Cited by 265 publications

References 32 publications

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure

Surface Roughness Prediction in Grinding: a Probabilistic Approach

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