2007 9th European Conference on Radiation and Its Effects on Components and Systems 2007
DOI: 10.1109/radecs.2007.5205525
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Evaluation of recent technologies of non-volatile RAM

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Cited by 9 publications
(15 citation statements)
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“…Again a word of warning for commercial devices: cells are very robust, but the periphery may be subject to latch-up, total dose issues, etc. [163], [175]. This is illustrated in Fig.…”
Section: A Reliability and Radiation Effectsmentioning
confidence: 92%
“…Again a word of warning for commercial devices: cells are very robust, but the periphery may be subject to latch-up, total dose issues, etc. [163], [175]. This is illustrated in Fig.…”
Section: A Reliability and Radiation Effectsmentioning
confidence: 92%
“…Over the years, the radiation induced damages to FRAMs including those associated with the single event effect (SEE) and total ionizing dose (TID) effect have been researched and reported [15][16][17][18][19][20][21]. Concerning the TID, previous studies have been conducted on issues including the retention degradation of ferroelectric materials [6,15], dose and dose rate dependence [16,17], temperature dependence [18], comparison of ferroelectric-embedded and CMOS-only circuits [19] and so on.…”
Section: Introductionmentioning
confidence: 99%
“…Concerning the TID, previous studies have been conducted on issues including the retention degradation of ferroelectric materials [6,15], dose and dose rate dependence [16,17], temperature dependence [18], comparison of ferroelectric-embedded and CMOS-only circuits [19] and so on. The ferroelectric materials have been reported to be able to withstand up to 10 Mrad(Si) [6], but the total dose failures of integrated FRAM devices have been reported at much lower dose levels [15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
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“…Since this non-volatile storage element is based on polarization and responds only to applied electrical fields, the FRAM memory cell is much less sensitive to soft errors from injected energetic particles compared to SRAM memory cells (charged based) [2], [3]. Considering that particle-induced parasitic currents cannot alter the polarization of the storage element, the susceptibility of the device to radiation effects is mostly due to failures in the control logic circuitry and peripheral circuit components such as the address decoders, I/O buffers, power switch, or sense amplifiers.…”
mentioning
confidence: 99%