Evaluation of pad life in chemical mechanical polishing process using statistical metrology

Muthukrishnan, N. Moorthy; Prasad, Sharad; Stine, B.E.; Loh, W.; Nagahara, R.; Chung, J.E.; Boning, Duane S.

doi:10.1117/12.284688

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1998

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“…While we discussed the connection to circuit performance evaluation in this paper, we believe that statistical metrology methods are also extremely powerful in developing and optimizing advanced process technology (e.g. the development of optimal CMP processes (10,11,12,23,29) or pads that minimize pattern dependencies), as well as in equipment selection and evaluation, and in process control. For example, CMP models are enabling more time and resource efficient processes which minimize the production of waste by-products in CMP.…”

Section: Summary and Future Workmentioning

confidence: 99%