Evaluation of Microstructure and Mechanical Properties in Dissimilar Joint of SSM7075 with SSM356 Aluminum Alloy using Diffusion Bonding

Abstract

Abstract. The aim of this study is to investigate joining parameters that affect microstructure and mechanical properties of diffusion bonding technique in dissimilar joints between SSM7075 and SSM356 aluminum alloys. Diffusion bonding methods were investigated by joining parameters as follows: contact pressure at 3 MPa, holding time 60 and 120 minutes and temperature at 673, 723, 773 and 823 K respectively, under argon atmosphere at 4 liters per minute. After experiments, the results of the investigation have shown that a condition used contact pressure at 3 MPa, holding time 120 minutes, and temperature at 773 K is complete and no defects and voids. Examination of the joint region using SEM and EDX showed that the microstructure in weld zone after welding is globular structure, and eutectics phases of two materials diffuse together. In weld zone, it was found that formation of eutectic phases has Al2CuMg, Mg2Si and Al2Mg2Zn3 phases along the bond interface, distributed throughout bond interface. The tensile tested showed the maximum tensile strength of 94.94 MPa. The hardness was tested for optimum hardness value, 121.20 HV. However, the heat during welding, resulting in precipitation within the aluminum matrix (α-Al), led to increased hardness after diffusion bonding.

Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

“…It is noteworthy that the oxides are generally distributed along the length of the interface and bonding zone, as shown in Figure 5b. The diffusion mechanism starts to diffuse from the higher concentration to the lower concentration [19], which is evaluated by substituted C elements shown in Figure 5a. The atom of C elements can insert into the aluminium matrix.…”

The Influence of Time, Atmosphere and Surface Roughness on the Interface Strength and Microstructure of AA6061–AA1050 Diffusion Bonded Components

“…Higher values are reported for the interface shear strength, but generally the bonding interface strength is much lower than the strength of the constituents that makeup the composite. The interface strength of dissimilar SSM7075- and SSM356-bonded pairs was investigated in [ 22 ]. Here too, the authors reported that the bonding temperature (in an Argon atmosphere) was the dominant factor governing the interface strength.…”