Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

Abstract

Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al2Mg3Zn3), T′(Zn10Al35Cu55) and MgZn2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.

Diffusion Bonding and Brazing of Advanced Materials

“…Meengam el al. [6] investigated the possibility of using a ZA27 zinc alloy interlayer to bond 7075 aluminum alloy by TLP. The authors revealed that it was possible to obtain a sound dissimilar joint but the bonding time and temperature have a crucial influence on the microstructure interface that is an intimate bond with the mechanical properties of the joints.…”

Realizing 10% Conversion Efficiency by Contact Engineering of Mg3Sb1.5Bi0.5 for Medium Temperature Thermoelectric Power Generation

“…Our idea is to bond this metal layer with the metal interconnect using the TLP process. TLP bonding is a well-known metallurgical joining process that has been tested on different metallic systems. , It works on the principle of the formation of a transient liquid phase, which reacts immediately to form intermetallic phases with higher melting temperatures. Typically, the metal combinations are chosen in such a way that one of the elements has a much lower melting temperature than the other.…”

The Liquid Fraction of ZA27 Zinc Alloy from TLP Diffusion Bonding Affecting Mechanical Properties and Microstructural Characterizations of SSC-ADC12 Aluminum Alloy

“…In particular, the bonding temperature affects the amount of liquid fraction of solder formed during welding. Thereby, this could affect the formation of defects after welding [3] and is a foremost cause of bonded strength [4]. Likewise, the TLP diffusion bonding atmosphere is also necessary for welding.…”