Evaluation of Micro Laser Sintering Metal 3D-Printing Technology for the Development of Waveguide Passive Devices up to 325 GHz

Abstract

In this paper, we propose an assessment up to 325 GHz of Micro Laser Sintering (MLS) metal 3D-Printing technology in order to achieve lightweight and cost-effective millimeter wave (mmW) passive function. We first designed and manufactured a bended WR5 waveguide in order to assess achievable roughness and insertion loss. In a second step, an existing 240 GHz choke horn antenna design, previously manufactured using metal coated Stereo Lithography Apparatus (SLA) and Selective Laser Melting (SLM) technologies, has been prototyped using MLS. Measured performances of the MLS antenna prototype have been benchmarked with SLA and DMLS ones. Achieved performances are promising since without any post processing MLS compete up to 325 GHz with metal coated SLA technology while it enables a metallic part manufactured in a single piece.

Facile integration of electro-optic SiO₂/ITO heterointerfaces in MIS structures for CMOS-compatible plasmonic waveguide modulation

“…The higher experimental IL level is attributed to the additional free carrier absorption caused by elevated ITO carrier density and scattering losses from the contact region. Effects from deposited layer roughnesses and various intrinsic defects, such as surface states and oxygen vacancies, could have played an additional role in this higher measured IL level [75][76][77] . Nonetheless, IL and CE values exhibit low variations between nm and 1600 nm, indicating a potential broadband modulator operation.…”

CMOS-compatible MIS–Schottky heterojunctions for plasmonic waveguide modulation

“…Additionally, scattering losses at the contact regions between the ITO and other layers might play a role in the higher measured IL. [14][15][16] Furthermore, the influence of deposited layer roughnesses and intrinsic material defects, such as surface states and oxygen vacancies, cannot be entirely ruled out. These imperfections can introduce additional scattering centers and energy traps, further contributing to the observed increase in IL.…”

220 GHz E-Plane Transition from Waveguide to Suspended Stripline Integrated on Industrial Organic Laminate Substrate Technology

“…So far, the packaging of mmW and THz circuits is achieved using metal waveguide-based assembly [7]. These modules are composed of a thin quartz substrate (~50 µm) on which the IC is assembled and a mechanical package integrating the improve achievable performance up to H-band, the micro laser sintering (MLS) technology, which uses powder with particle sizes < 5 µm, has been recently proposed [14] to manufacture 3D printed waveguide parts with improved surface roughness without any post processing and consequently reduced loss.…”