2013
DOI: 10.1016/j.ijadhadh.2013.01.004
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Evaluation of kissing bond in composite adhesive lap joints using digital image correlation: Preliminary studies

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Cited by 96 publications
(27 citation statements)
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“…Some attempts to use DIC to evaluate composite structures and adhesive joints have also been reported. [39][40][41][42] Colavito et al [39] have given a detailed presentation on refinements to be made to DIC technique to extract adhesive strains in lap joints. Figure 5 illustrates the experimental setup used for the current work.…”
Section: Measurement Of Adhesive Strains Using Dicmentioning
confidence: 99%
“…Some attempts to use DIC to evaluate composite structures and adhesive joints have also been reported. [39][40][41][42] Colavito et al [39] have given a detailed presentation on refinements to be made to DIC technique to extract adhesive strains in lap joints. Figure 5 illustrates the experimental setup used for the current work.…”
Section: Measurement Of Adhesive Strains Using Dicmentioning
confidence: 99%
“…[8,9] Recently, emphasis has been given on detecting a lack of adhesion at the interface, "kissing bonds" or "weak bonds", since the mere detection of voids prove to be insufficient to guarantee good bond quality. [10] Different techniques have been investigated such as ultrasonic techniques, [11][12][13][14] thermography, [15,16] digital image correlation, [17] dynamic response [18] etc. Results show the dependency on compressive loads for the detectability through ultrasonic techniques [19] and the potential of nonlinearity shown when "weak bonds" are illuminated with ultrasound.…”
Section: Introductionmentioning
confidence: 99%
“…When a kissing bond appears, surrounded by a wellbonded area, sufficient compressive residual stress at the adherend-adhesive interface makes the flaw invisible for many conventional nondestructive testing methods such as ultrasounds. In [6] digital image correlation (DIC) has been used to detect and evaluate kissing bonds and the main finding is that digital image correlation technique could detect the kissing bonds even at 50% of the failure load. The main downside of this method is that it requires a heavy experimental effort and fall outside the category of the possible SHM approaches.…”
Section: Introductionmentioning
confidence: 99%