2010
DOI: 10.1149/1.3481630
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Evaluation of HfLaOx as Blocking Layer for Innovative Nonvolatile Memory Applications

Abstract: In this paper, a study of a La-based high-k oxide to be employed as blocking oxide in future non-volatile scaled memory devices is presented. Hf1-xLaxOy deposited by atomic layer deposition is considered. In order to allow the integration of this material, its chemical interaction with an Al2O3 cap layer has been studied. Moreover, the electrical characteristics have been evaluated after integration in capacitor structures. The rare earth-based ternary oxide presents promising characteristics to be a good cand… Show more

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Cited by 4 publications
(3 citation statements)
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“…The ternary and quaternary materials described in the tables cover a wide variety of applications, but several are of particular note. A large number of materials have been studied for use as high- k dielectrics, , particularly Hf-, , Ti-, and La-containing , compounds. Many of these studies have been dedicated to examining compositional effects of various metal atoms in ternary oxides in order to find materials with higher dielectric constants.…”
Section: Overview Of Ternary and Quaternary Ald Processesmentioning
confidence: 99%
See 1 more Smart Citation
“…The ternary and quaternary materials described in the tables cover a wide variety of applications, but several are of particular note. A large number of materials have been studied for use as high- k dielectrics, , particularly Hf-, , Ti-, and La-containing , compounds. Many of these studies have been dedicated to examining compositional effects of various metal atoms in ternary oxides in order to find materials with higher dielectric constants.…”
Section: Overview Of Ternary and Quaternary Ald Processesmentioning
confidence: 99%
“…First, the bulk phase diagram can be used to ascertain which cycle ratio (to tune the composition) and annealing conditions (to tune mixing and phase) need to be employed. In most cases, ALD of a film with the correct stoichiometry does not directly result in a crystalline phase, and a post-deposition anneal is required (this can also be seen in Tables –). ,,,, ,,,, ,,, ,,,,,,,,,,,,,, Typical annealing conditions are under nitrogen or oxygen atmosphere or in air, and the temperature required to begin crystallization is generally between 600 and 800 °C, with the required temperature often varying depending on the composition of the film. However, while the phase diagram provides thermodynamic information on the bulk system, it has been shown that it often does not rigorously predict the formation of phases in ALD films. , This phenomenon has been hypothesized to be a result of the layer-by-layer growth character of ALD or of bulk material data not applying to the nanometer thickness scale of ALD films, but further investigation is required to unravel the effects.…”
Section: Intermixing and Phase Formationmentioning
confidence: 99%
“…Compared with Al 2 O 3 , LaAlO x as BL brought 40% and 32% improvements in program speed and V th saturation window, better robustness to voltage stress, and better retention performance below 120 • C. Besides, HfLaO has also been applied as BL and exhibited improvements in V th saturation window and robustness to voltage stress due to its higher k value (~22) compared to Al 2 O 3 . However, the retention performance degraded after La incorporation, probably due to decreased conduction-band offset [79,80].…”
Section: Nonvolatile Memorymentioning
confidence: 99%