Evaluation of Fatigue Damage in Solder Joints of Electronic Devices

Uegai, Yasumi; Tani, Shuichi; Yoshioka, Shoji; Inoue, Akio; Hirota, J.

doi:10.1016/b978-0-08-037890-9.50459-2

Cited by 1 publication

(2 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Several methods can be used to evaluate the thermal fatigue life of solder joints [1][2]. In this study, the initial fatigue crack occurring in the solder joints is used for the thermal fatigue life [3][4].…”

Section: The Evaluation Methodsmentioning

confidence: 99%

See 1 more Smart Citation

The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints

Jin

Yu²,

Shibutani

et al. 2005

KEM

View full text Add to dashboard Cite

In recent years, package downsizing has become one of biggest trends in packaging technologies because of miniaturization and the high integration of electronic devices. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. But, the reliability of thermal fatigue life may be lowered by the dispersion of design factors such as the dimensions, shapes, and material properties of package systems. Also, the fracture modes (fatigue fracture, brittle destruction in the interface, and compound destruction, and so on) will be affected by these dispersion factors. Although this dispersion should be reduced in order to improve the reliability, reducing all dispersion is inefficient and time-consuming. So, the factors that greatly contribute to thermal fatigue life have to be reduced. In this study, evaluations of the influence of various design factors on the reliability of soldered joints of a BGA (Ball Grid Array) were carried out, and got each influence. With the results, design engineers can rate each factor’s effect on reliability and assess the reliability of their design beginning at the concept design stage. Consequently, it will be possible to avoid almost all reliability problems from the beginning. Also, by rating the factors, the design period can be shortened

show abstract

Section: The Evaluation Methodsmentioning

confidence: 99%

“…By using these fatigue reliability evaluation methods [1][2][3][4], the thermal fatigue life is evaluated. But, these methods only are not enough, because design engineers can't determine the each design factor's effect rate on the reliability.…”

Section: The Evaluation Methodsmentioning

confidence: 99%