2019
DOI: 10.1109/tcpmt.2018.2866972
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Evaluation of Additively Manufactured Microchannel Heat Sinks

Abstract: Microchannel heat sinks allow removal of dense heat loads from high-power electronic devices at modest chip temperature rises. Such heat sinks are produced primarily using conventional subtractive machining techniques or anisotropic chemical etching, which restricts the geometric features that can be produced. Owing to their layer-by-layer and direct-write approaches, additive manufacturing (AM) technologies enable more design-driven construction flexibility and offer improved geometric freedom. Various AM pro… Show more

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Cited by 41 publications
(16 citation statements)
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“…A flow loop identical to that described in Ref. [19] The test section presses the heat sink onto the heater, positions thermocouples for temperature measurements, and contains pressure taps to measure the pressure drop; slight modifications were made compared to Ref. [19].…”
Section: Experimental Facility and Proceduresmentioning
confidence: 99%
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“…A flow loop identical to that described in Ref. [19] The test section presses the heat sink onto the heater, positions thermocouples for temperature measurements, and contains pressure taps to measure the pressure drop; slight modifications were made compared to Ref. [19].…”
Section: Experimental Facility and Proceduresmentioning
confidence: 99%
“…[19] The test section presses the heat sink onto the heater, positions thermocouples for temperature measurements, and contains pressure taps to measure the pressure drop; slight modifications were made compared to Ref. [19]. Due to the lack of an incorporated lid on both heat sinks due to a desire to visualize the heat transfer features, a silicone rubber gasket was used to seal the interface between the heat sink and a polycarbonate block that has features to route flow into and out of the heat sink.…”
Section: Experimental Facility and Proceduresmentioning
confidence: 99%
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“…Electrochemical fabrication, a group of processes based on photolithography and electrodeposition of metals, may fabricate minimum features around (4-25) µm with 2 µm tolerances, but supports only a limited set of materials and small build volumes [99]. On the other hand, SLS processes are less expensive and may fabricate minimum features around (200-400) µm with 50 µm tolerances [99]. A high surface area to volume ratio is essential for improved forced convection heat transfer in confined spaces.…”
Section: Current and Future Challengesmentioning
confidence: 99%