Abstract:The use of conventional solder bump for flip chip interconnection is now quite widespread and much infrastructure has been invested in to support this technology. According to the 2003 ITRS roadmap by 2007 bump pitch of 80 um will be needed. The shrink of bump pitch is driven by migration to 90 um technology. The die to joint gap will also shrink proportionately and start causing problems in underfill flow as well as increase stress on the fragile low -k dielectrics on die face. Tin capped gold column bumps we… Show more
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