Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps

Huang, Jung-Tang; Chao, Pen-Shan; Hsu, Hou-Jun; Shih, Sheng-Hsiung

doi:10.1109/emap.2006.4430613

2006 International Conference on Electronic Materials and Packaging 2006

DOI: 10.1109/emap.2006.4430613

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Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps

Jung-Tang Huang

Pen-Shan Chao

Hou-Jun Hsu

et al.

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Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps

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References 21 publications

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