Extreme Ultraviolet (EUV) Lithography IX 2018
DOI: 10.1117/12.2297266
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EUV metal oxide hybrid photoresists: ultra-small structures for high-resolution patterning

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Cited by 3 publications
(6 citation statements)
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“…17 These performance targets require research on new materials that incorporate elements with high EUV photon absorption cross-sections and, at the same time, are composed of small units consistent with future resolutions targets. 13,[18][19][20] Metal oxoclusters are hybrid molecular compounds 10,21 and hold great potential as resist platforms for EUV lithography applications. By choosing the right metalcomponent, they can meet the desired properties for EUV photon absorption while offering intrinsically small and homogeneous size (monodisperse) due to their molecular nature.…”
Section: Introductionmentioning
confidence: 99%
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“…17 These performance targets require research on new materials that incorporate elements with high EUV photon absorption cross-sections and, at the same time, are composed of small units consistent with future resolutions targets. 13,[18][19][20] Metal oxoclusters are hybrid molecular compounds 10,21 and hold great potential as resist platforms for EUV lithography applications. By choosing the right metalcomponent, they can meet the desired properties for EUV photon absorption while offering intrinsically small and homogeneous size (monodisperse) due to their molecular nature.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, molecular materials based on Zn have been investigated and have shown promising results. 19,23,24 In our approach, a denser Zn metallic oxo core is used as the inorganic building block in order to enhance the EUV absorbance of the material. The organic ligands surrounding the inorganic EUV-absorbing core are envisioned as the main factor defining the solubility properties.…”
Section: Introductionmentioning
confidence: 99%
“…The newest, photoresists that enable sub-10 nm, hp resolution to satisfy the stringent requirements of performance and throughput imposed by the aggressive logic device-scaling are limited, even though the EUV ecosystem is ready for HVSM to the chipmakers 30 34 In continuation with this, a photoresist must produce patterns with a line width roughness (LWR) of <20%, 35 37 which necessitates a higher dose to retain chemical noise and shot noise at a tolerable level originating from the molecular nature of resists formulation and probabilistic interaction behavior of available fewer EUV photons leading to the low-energy secondary electrons (LESEs) generation in the resists dense pattern formation 38 . In unison, the dose should be low enough (20 mJ cm2) 39 to enable high throughput chip manufacturing.…”
Section: Introductionmentioning
confidence: 99%
“…This motivates for the research on new materials that incorporate elements with high EUV absorption cross-sections but are composed of small units in agreement with the targeted future resolutions. 7,[9][10][11][12] Metal oxoclusters are hybrid molecular compounds that are ideal platforms for this purpose. By choosing the right metalcomponent, they can meet the desired properties for EUV photon absorption and they are intrinsically small and have a homogeneous size (monodispersity).…”
Section: Introductionmentioning
confidence: 99%
“…Recently, molecular materials based on Zn have been investigated and have shown promising results. 11,14,15 In our approach, a denser Zn metallic oxo core is used as the building block in order to enhance the EUV absorbance of the material. The organic ligands surrounding a condensed EUV absorbing core are envisioned as the main factor for the solubility properties and play a major role in the reactivity of the material, which determines in turn the solubility switch upon exposure.…”
Section: Introductionmentioning
confidence: 99%