2002
DOI: 10.1016/s0925-9635(01)00563-5
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Etching of p- and n-type doped monocrystalline diamond using an ECR oxygen plasma source

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Cited by 13 publications
(6 citation statements)
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“…A thin layer of nickel (65 nm) has then been deposited and patterned using a standard electron-gun evaporator and lift-off technique. This Ni layer acts as a mask for the plasma etching of the diamond structures subsequently done using Electron Cyclotron Resonance oxygen plasma [11] and a −27 V dc bias for ≈ 8 min. This leads to an etching rate of ≈ 40 nm/min.…”
Section: Methodsmentioning
confidence: 99%
“…A thin layer of nickel (65 nm) has then been deposited and patterned using a standard electron-gun evaporator and lift-off technique. This Ni layer acts as a mask for the plasma etching of the diamond structures subsequently done using Electron Cyclotron Resonance oxygen plasma [11] and a −27 V dc bias for ≈ 8 min. This leads to an etching rate of ≈ 40 nm/min.…”
Section: Methodsmentioning
confidence: 99%
“…Some of these "as-grown" samples have been either polished by "scaife" polishing or etched by pure oxygen ECR plasma under optimised conditions [15] during 1 hour, an operation which removed from 3 to 4 µm of the diamond layer. The detailed description of the ECR equipment has been already done elsewhere [19,20]. After growth, the surface of one of the samples has been bevelled by mechanical polishing with an angle of 5 degrees.…”
Section: Methodsmentioning
confidence: 99%
“…The boron-doped film has been deposited on an E6 CVD (100) To study the buried part of the epilayer, a 500 nm deep ECR (microwave electron cyclotron resonance plasma of oxygen) etching has been performed on half of the sample surface. A detailed description of the ECR equipment has been already given elsewhere [5,6]. The layer was etched at room temperature for 8 min under a RF self-bias voltage of 27.5 V, a microwave power of 1600 W, and an oxygen pressure of 2.35 mTorr.…”
Section: Methodsmentioning
confidence: 99%