Erratum: “A noninvasive bunch length monitor for femtosecond electron bunches” [Appl. Phys. Lett. <b>70</b>, 529 (1997)]

Wang, D. X.; Krafft, Geoffrey; Price, E.; Wood, P. A. D.; Porterfield, David W.; Crowe, T.W.

doi:10.1063/1.119269

Cited by 4 publications

(4 citation statements)

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“…The process relies largely on chemical and low pressure mechanical processes to transfer patterns. SFIL is related to other micromolding or imprint processes [1][2][3][4][5] in that all of these use the topography of a template to define the pattern created on a substrate. The two key differences between SFIL and other imprint lithography techniques are that this process is based on a low viscosity, photocurable liquid and a transparent, rigid template.…”

Section: Introductionmentioning

confidence: 99%

Step and flash imprint lithography: Template surface treatment and defect analysis

Bailey¹,

Choi²,

Colburn³

et al. 2000

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

365

223

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We have finished the construction of an automated tool for step and flash imprint lithography. The tool was constructed to allow defect studies by making multiple imprints on a 200 mm wafer. The imprint templates for this study were treated with a low surface energy, self-assembled monolayer to ensure selective release at the template-etch barrier interface. This surface treatment is very durable and survives repeated imprints and multiple aggressive physical and chemical cleanings. The imprint and release forces were measured for a number of successive imprints, and did not change significantly. The process appears to be ''self-cleaning.'' Contamination on the template is entrained in the polymerizing liquid, and the number of defects is reduced with repeated imprints.

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Section: Introductionmentioning

confidence: 99%

Step and flash imprint lithography: Template surface treatment and defect analysis

Bailey¹,

Choi²,

Colburn³

et al. 2000

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

365

223

View full text Add to dashboard Cite

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“…SFIL is related to other micromolding or imprint processes [1][2][3][4][5] in that all of these use the topography of a template to define the pattern created on a substrate. SFIL uses no projection optics, no lenses, and operates at room temperature.…”

Section: Introductionmentioning

confidence: 99%

Step and flash imprint lithography: Defect analysis

Bailey

Smith

Choi

et al. 2001

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Step and flash imprint lithography ͑SFIL͒ is a promising, low cost alternative to projection printing. This technique has demonstrated very high resolution and overlay alignment capabilities, but it is a contact printing technique so there is concern about defect generation and propagation. A series of experiments has been carried out with the goal of quantifying the effect of defect propagation. To that end, each unit process in SFIL was studied independently. The number of particles added during handling and transportation and due to SFIL machinery was deemed acceptable, and the added particles should not complicate the inspection of process defects. The concept of a ''self-cleaning'' process in which the imprint template becomes cleaner by imprinting was revisited. Inspection of an imprint template before and after imprinting revealed that the template actually becomes cleaner with imprinting. Visual inspection of multiple imprints did not reveal any systematic generation or propagation of defects.

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“…Various different techniques have demonstrated the measurement of subpicosecond bunch lengths including streak cameras [1], rf deflecting structures [2,3], electro-optic techniques [4], coherent synchrotron radiation [5,6], and coherent diffraction radiation [7,8]. The ideal method will be nondestructive, have sub 100 fs resolution and be extendable to very short bunches, i.e., tens of femtoseconds.…”

Section: Introductionmentioning

confidence: 99%

Measurement of subpicosecond bunch lengths using coherent Smith-Purcell radiation

Korbly

Kesar

Temkin

et al. 2006

Phys. Rev. ST Accel. Beams

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We report the use of coherent Smith-Purcell radiation to measure the bunch length of femtosecondscale, 15 MeV electron bunches produced by a 17 GHz rf accelerator. The Smith-Purcell radiation was produced by passing a train of electron bunches above a metal grating. The radiation was verified as Smith-Purcell radiation by measuring the resonance condition, dependence on beam current, and dependence on beam height above the grating. Measurements of the intensity of the radiation vs emission angle were analyzed to obtain the bunch length. The accelerator was operated in two different modes, producing bunches that were determined to have bunch lengths of 600 and 1000 200 fs. These nondestructive bunch length measurements were found to agree well with an independent, but destructive, measurement using a microwave deflecting cavity.

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Erratum: “A noninvasive bunch length monitor for femtosecond electron bunches” [Appl. Phys. Lett. 70, 529 (1997)]

Cited by 4 publications

References 0 publications

Step and flash imprint lithography: Template surface treatment and defect analysis

Step and flash imprint lithography: Template surface treatment and defect analysis

Step and flash imprint lithography: Defect analysis

Measurement of subpicosecond bunch lengths using coherent Smith-Purcell radiation

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