The processes of modifying the structural and optical properties of FP9120 and S1813 diazoquinone-novolac photoresist films on single-crystal silicon wafers beyond the range of ions by implantation of light B + , P + and heavy Sb + ions have been studied using the techniques of attenuated total reflection Fouriertransform IR spectroscopy, indentation, and measurement of reflection spectra. It has been shown that during the implantation of light B + and P + ions, the processes involving the photosensitive photoresist component, naphthoquinone diazide, are dominant, which lead to the formation of ketene and its subsequent reactions. In the case of implantation of heavy Sb + ions, radiation-induced reactions behind the implantation layer proceed predominantly with the participation of macromolecules of the main photoresist component phenol-formaldehyde resin. The established differences are due to the prevalence of the electronic stopping mechanism for light ions and nuclear stopping for heavy ions.