Epoxy Mold Compound Curing Behavior and Mold Process Cure Time Interaction on Molded Package Performance

Garete, April Joy; Fadullo, Marlon F.; Roscain, Reinald John S.

doi:10.1109/eptc47984.2019.9026644

Cited by 3 publications

(1 citation statement)

References 3 publications

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“…The post-mold curing has improved the flexural strength of the package. This observation enables agreement with the results in a previous study [13] that longer mold cure time results in an improved bending strength. Post-mold curing contributes to the realization of improved mechanical properties due to better crosslinking of the epoxy-resin network.…”

Section: Resultssupporting

confidence: 92%

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Talledo¹

2021

JERR

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Thinner semiconductor package is becoming popular especially in consumer electronics applications. As package becomes thinner, it is more vulnerable to package crack when subjected to external load. It is important to ensure that the package is strong enough to resist package cracking. This paper presents the study of package flexural strength under different epoxy mold compound curing condition. A 3-point bend test was done to characterize the breaking strength of the package that was subjected to post-mold curing. It was then compared to the strength of the package not subjected to post-mold curing (PMC). Results of the bend testing showed that the package flexural strength is much lower when the package is not subjected to post-mold curing. This study demonstrates that the measurement of flexural strength can be used to determine if the package has undergone post-mold curing or not. Performing the right post-mold curing of the thin molded package is required to ensure higher flexural strength.

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Section: Resultssupporting

confidence: 92%

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Talledo¹

2021

JERR

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Epoxy Mold Compound Characterization for Modeling Packaging Reliability

Tomas

Lambert

Frémont

et al. 2022

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Capacity Improvement for Transfer Molding Trough Reduction of Mold Curing Time

Belalo¹,

Maming²

2021

JERR

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This paper will discuss the improvement made to increase machine capacity in order to be prepare for incoming demand ramp-up and to free up machine allocation to back-up automotive machine. Using DMAIC methodology (Define, Measure, Analyze, Improve and Control) approach, mold curing time identified as the top contributor during time study of the process with 120 secs consumed time per shot. A Differential Scanning Calorimetry (DSC) and Curability Curve study for molding compound was conducted from both internal and external expertise to get the optimum lower range of cure time. Considering all the quality risk using Risk assessment, the success of reducing Mold curing time from 120secs to 80secs increases 25% machine capacity of transfer Molding for Quad Flat No leads(QFN) / Quad Flat No leads multi-Row(QFN-mR) with significant cost savings. The project was able also to free up 3 molding system to support upcoming products.

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Epoxy Mold Compound Curing Behavior and Mold Process Cure Time Interaction on Molded Package Performance

Cited by 3 publications

References 3 publications

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Epoxy Mold Compound Characterization for Modeling Packaging Reliability

Capacity Improvement for Transfer Molding Trough Reduction of Mold Curing Time

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