2018
DOI: 10.1088/2053-1591/aaf264
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Epitaxial thin film transfer for flexible devices from reusable substrates

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Cited by 4 publications
(4 citation statements)
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“…The expected in‐plane lattice mismatch of the α‐ Al 2 O 3 (0001)/CdTe (111) system is 3.7%, as seen from the lattice spacings in Figure 1a; however, CdTe films are observed to be strain relaxed without the density of dislocation networks that would be expected from the misfit strain (Figure S3, Supporting Information). The demonstrated ease of thin film transfer seen in Figure 1d, which has been utilized prior to fabricate a simple rectifying heterostructure, [ 16 ] an observed preferential etching of the interface during lift‐out preparation (Figure S4, Supporting Information), and a lack of residual heteroepitaxial strain in the film, as measured by high resolution XRD and observed in STEM images (Figures S5 and S6, Supporting Information), are all consistent with weak bonding at the interface. Sapphire substrates, post film transfer, have also been shown to support multiple film regrowth without significant quality degradation.…”
Section: Figurementioning
confidence: 99%
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“…The expected in‐plane lattice mismatch of the α‐ Al 2 O 3 (0001)/CdTe (111) system is 3.7%, as seen from the lattice spacings in Figure 1a; however, CdTe films are observed to be strain relaxed without the density of dislocation networks that would be expected from the misfit strain (Figure S3, Supporting Information). The demonstrated ease of thin film transfer seen in Figure 1d, which has been utilized prior to fabricate a simple rectifying heterostructure, [ 16 ] an observed preferential etching of the interface during lift‐out preparation (Figure S4, Supporting Information), and a lack of residual heteroepitaxial strain in the film, as measured by high resolution XRD and observed in STEM images (Figures S5 and S6, Supporting Information), are all consistent with weak bonding at the interface. Sapphire substrates, post film transfer, have also been shown to support multiple film regrowth without significant quality degradation.…”
Section: Figurementioning
confidence: 99%
“…Sapphire substrates, post film transfer, have also been shown to support multiple film regrowth without significant quality degradation. [ 16 ]…”
Section: Figurementioning
confidence: 99%
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“…For thermomechanical delamination, a stressor and handle are applied to a film stack grown under standard conditions and a negative temperature gradient is applied, causing the stressor to contract until spontaneous cleavage occurs. For sx material (e.g., Si, [55,56] III-Vs, [57] CdTe), [58] it is common to initiate a crack prior to the final anneal step such that delamination will occur during the cooldown. Other studies have thermomechanically cleaved sx films without the preinitiated crack, by applying a much larger thermal strain, e.g., by dipping in LN 2 .…”
Section: Background On Delamination Techniquesmentioning
confidence: 99%