Controlled
delamination of thin-film photovoltaics (PV) post-growth
can reveal interfaces that are critical to device performance yet
are poorly understood because of their inaccessibility within the
device stack. In this work, we demonstrate a technique to lift off
thin-film solar cells from their glass substrates in a clean, reproducible
manner by first laminating a polymeric backsheet to the device and
then thermally shocking the system at low temperatures (T ≤ −30 °C). To enable clean delamination of diverse
thin-film architectures, a theoretical framework is developed and
key process control parameters are identified. Focusing on cadmium
telluride (CdTe) devices, we show that the lamination temperature
and device architecture control the quality of lift-off, while the
rate at which the film stack is removed is controlled by the delamination
temperature. Crack-free CdTe devices are removed and successfully
recontacted, recovering up to 80% of the original device efficiency.
The areal density of these devices is ∼0.4 kg m–2, a reduction of over an order of magnitude relative to their initial
weight on glass. The framework developed here provides a pathway toward
both the development of inexpensive, flexible PV with high specific
power and the study of previously buried interfaces in thin-film architectures.
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