2014
DOI: 10.1016/j.tsf.2013.10.064
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Epitaxial growth of strained and unstrained GeSn alloys up to 25% Sn

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Cited by 112 publications
(89 citation statements)
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“…The most efficient way, in our opinion, to fabricate high quality, partially strain relaxed epilayers is to grow several hundred nanometer thick GeSn layers on Ge virtual substrates (Ge-VS). Significant progress has been made in recent years in epitaxy of these alloys by Chemical Vapor Deposition (CVD) [11][12][13] and Molecular Beam Epitaxy 14,15 . However, the low growth temperatures required for Sn incorporation still lead to an epitaxial breakdown in thick layers due to a strong increase of surface roughness for Sn concentrations > 10 at.% 14 .…”
Section: Introductionmentioning
confidence: 99%
“…The most efficient way, in our opinion, to fabricate high quality, partially strain relaxed epilayers is to grow several hundred nanometer thick GeSn layers on Ge virtual substrates (Ge-VS). Significant progress has been made in recent years in epitaxy of these alloys by Chemical Vapor Deposition (CVD) [11][12][13] and Molecular Beam Epitaxy 14,15 . However, the low growth temperatures required for Sn incorporation still lead to an epitaxial breakdown in thick layers due to a strong increase of surface roughness for Sn concentrations > 10 at.% 14 .…”
Section: Introductionmentioning
confidence: 99%
“…The non-equilibrium processes during MBE are effective to avoid Sn segregation, achieved by low temperature growth, strain engineering, etc. The Sn concentration in GeSn has reached the direct-indirect transition point by several groups, [17][18][19][20][21][22] and some are even much higher, for example 25% 23 and 27%. 24 However, the low growth temperature is a major limitation to obtain device-grade quality materials.…”
Section: Introductionmentioning
confidence: 99%
“…concentration have been grown by low temperature molecular beam epitaxy (MBE), 12 chemical vapor deposition [13][14][15][16] or solid phase epitaxy. 17 Moreover, some ultra-high Sn concentration GeSn alloy has been grown by MBE at a growth temperature less than 200 • C, for example 25% 18 and 27%. 19 The non-equilibrium processes during MBE are effective to avoid Sn segregation.…”
Section: Introductionmentioning
confidence: 99%
“…20 However, low temperature MBE growth of GeSn alloy will introduce many defects, 21 which are detrimental to light emission from such a material. 18,22 Therefore, to obtain high quality and direct bandgap GeSn alloy, the dilemma between the Sn segregation at a high growth temperature and the high defect density introduced at a low growth temperature must be overcome. 23 Thermal annealing leads to decrease in defect density and improves optical quality of the GeSn alloy.…”
Section: Introductionmentioning
confidence: 99%
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