Enthalpy of formation of Au–Sn intermetallic phases. Part II

Dębski, A.; Gąsior, W.; Moser, Z.; Major, R.

doi:10.1016/j.jallcom.2011.02.160

Cited by 10 publications

(2 citation statements)

References 17 publications

(29 reference statements)

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“…Based on the mass of the Au-Sn layer, an estimated value of 15.1 J/g for the h Eutectic was obtained. When comparing our value with values from other studies, our value demonstrated to be similar to what was reported by Debski (∼10.3 J/g [27], [28]). The difference can be attributed to solid-state reactions between the species that may have occurred during the heating ramp or even during the deposition process.…”

Section: B Thermal Stability Characterizationsupporting

confidence: 92%

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

Rodriguez

Ibitayo

Quintero

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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There is a need for electromechanical devices capable of operating in high-temperature environments (> 200°C) for a wide variety of applications. Today's wide-bandgap semiconductor-based power electronics have demonstrated a potential of operating above 400°C, however, they are still limited by packaging. Among the most promising alternatives is the Au-Sn eutectic solder, which has been widely used due to its excellent mechanical and thermal properties. However, the operating temperature of this metallurgical system is still limited to ∼250°C owing to its melting temperature of 280°C. Therefore, a high-temperature-resistant system is much needed, but without affecting the current processing temperature of ∼325°C, typically exhibited in most high-temperature Pb-free solders. In this paper, we present the development and characterization of a fluxless die-attach soldering process based on goldenriched solid-liquid interdiffusion (SLID). A low-melting-point material (eutectic Au-Sn) is deposited in the face of a substrate, whereas a high-melting-point material, gold in this instance, is deposited in its mating substrate. Deposition of all materials was performed using a jet vapor deposition (JVD) equipment where thicknesses are controlled to achieve specific compositions in the mixture. Sandwiched coupons are isothermally processed in a vacuum reflow furnace for different reflow times. Postprocessed samples confirm the interdiffusion mechanism as evidenced by the formation of sound joints that prove to be thermally stable up to ∼490°C after the completion of the SLID process. Differential scanning calorimetry demonstrate the progression of the SLID process by quantifying the remaining low-meltingpoint constituent as a function of time and temperature, this serving as an indicator of the completion of the soldering process. Mechanical testing reveals a joint with shear strength varying from 39 to 45.5 MPa, demonstrating to be stable even after 500 h of isothermal aging. Moreover, these investigations successfully demonstrate the use of the Au-Sn SLID system and the JVD technology as potential manufacturing processes and as a leadfree die-attach technology.Index Terms-Fluxless, hermetic packages, isothermal solidification, jet vapor deposition (JVD), lead-free, shear strength, SLID, solder, transient liquid phase (TLP) bonding.

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Section: B Thermal Stability Characterizationsupporting

confidence: 92%

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

Rodriguez

Ibitayo

Quintero

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…For the measurement of the formation enthalpy of the BLi phase by the direct reaction, the same calorimeter which was applied in our earlier studies [29][30][31][32] was used. The only difference concerned the construction of the crucible in which the dissolution of the metals or compounds was conducted.…”

Section: Resultsmentioning

confidence: 99%

Formation Enthalpy of Bli Intermediate Phase

Gąsior¹,

Dębski²,

Major³

2014

Archives of Metallurgy and Materials

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The formation enthalpy of the BLi (B 48 Li 52 ) intermetallic phase was measured with the use of the water reaction and the direct reaction calorimetric method. The phase was prepared of weighed amounts of B and Li in a glove-box filled with high purity argon. The BLi phase was confirmed with using the X-ray diffraction investigations. The experiments were carried out with the use of a water reaction calorimeter (water reaction calorimetric technique) at 25• C (298 K) in air, as well as a direct reaction calorimeter at 752• C in high purity argon. The formation enthalpy value obtained for the BLi phase in the case of the water reaction calorimetric method equaled -30.3±2.2 kJ/mole of atoms and in the case of the direct synthesis technique -29.4±2.0 kJ/mole of atoms.Keywords: Boron-lithium system, calorimetry, thermochemistry, hydrogen storage Entalpia tworzenia fazy międzymetalicznej BLi (B 48 Li 52 ) została zmierzona przy użyciu metody rozpuszczania w wodzie oraz metody bezpośredniej reakcji. Faza była wytworzona w komorze manipulacyjnej w atmosferze oczyszczonego argonu z odpowiednich naważek B oraz Li. Eksperymenty zostały przeprowadzone przy użyciu kalorymetru wodnego (technika kalorymetryczna pozwalająca na pomiar reakcji z wodą) w 25• C (298 K) w powietrzu, a także przy użyciu metody bezpośredniej reakcji w 752• C w atmosferze argonu o wysokiej czystości. Uzyskana wartość entalpii tworzenia fazy BLi w przypadku kalorymetrycznej metody reakcji z wodą wynosiła -30,3±2,2 kJ/mol atomów a w przypadku metody bezpośredniej reakcji: -29,4±2,0 kJ/mol atomów.

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Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder

Huang

Liu

et al. 2017

J Mater Sci: Mater Electron

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Enthalpy of formation of Au–Sn intermetallic phases. Part II

Cited by 10 publications

References 17 publications

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

Formation Enthalpy of Bli Intermediate Phase

Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder

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