2017
DOI: 10.1002/adma.201605848
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Enhancing the Performance of Stretchable Conductors for E‐Textiles by Controlled Ink Permeation

Abstract: Delivery of electronic functionality to the human body using e-textiles is important for realizing the future of wearable electronics. Printing is a promising process for large scale manufacturing of e-textile since it enables arbitrary patterns using a simple and inexpensive process. However, conductive inks printed atop of textile are vulnerable to cracking because of the deformable and porous structure of textiles. The authors develop a mechanically and electrically robust wiring by controlling ink permeati… Show more

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Cited by 238 publications
(261 citation statements)
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References 37 publications
(34 reference statements)
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“…The deep permeation of patterns prevents the peeling and stress concentration by soldering. In addition, the proposed approach is compatible with other durability-enhancement methods, such as the formation of small rigid islands only at the connection point of components [23] and the gradual change in stiffness around the connection point which reduces the stress concentration. To verify the improvement in durability by deep permeation, a type of surface mount component was soldered on printed patterns with different permeation depths, and the durability of the samples was evaluated by measuring the variations in resistance due to mechanical deformation.…”
Section: Introductionmentioning
confidence: 89%
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“…The deep permeation of patterns prevents the peeling and stress concentration by soldering. In addition, the proposed approach is compatible with other durability-enhancement methods, such as the formation of small rigid islands only at the connection point of components [23] and the gradual change in stiffness around the connection point which reduces the stress concentration. To verify the improvement in durability by deep permeation, a type of surface mount component was soldered on printed patterns with different permeation depths, and the durability of the samples was evaluated by measuring the variations in resistance due to mechanical deformation.…”
Section: Introductionmentioning
confidence: 89%
“…In recent years, electronic textiles (e-textiles) have attracted significant research attention with respect to the development of new biological information monitoring systems [1][2][3][4][5][6], human interface systems [7,8], and fashions [9,10], among other schemes [11][12][13][14][15][16][17][18]. At present, only conductive tracks and pads and several types of sensors can be formed on a textile by weaving, knitting, and stitching of conductive yarns on the textile [9,[19][20][21], or by printing of conductive inks on the textiles [3,22,23]. Moreover, various types of electronic components such as transistors, batteries, and microprocessors cannot be directly fabricated on a textile by the weaving, knitting, and stitching, as well as printing processes.…”
Section: Introductionmentioning
confidence: 99%
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“…Alternative techniques have been developed to fabricate conductive textiles, such as integrating metal filaments with yarns, coating fibers with a thin layer of conductive materials (metal nanoparticles/nanowires, carbon nanotubes, graphene, etc. ), or direct patterning of conducting polymers, and inkjet/stencil/screen/nozzle printing of conductive materials onto textiles ( Figure ) . The inclusion of metal wires in the yarns would increase the stiffness of the textiles and thereby decrease the wear comfort.…”
Section: Materials Designsmentioning
confidence: 99%
“…[8][9][10][11][12][13][14][15][16][17] However, the mixing method requires high volume ratio of conductive filler in the elastic substrate, which usually reduces elasticity; [10,12] whereas, the coating method often raises concerns of delamination due to Young's modulus mismatch between elastomeric polymers and active materials. Stretchable fiber conductors usually consist of elastic fiber substrates and conductive fillers, and mixing and coating methods are two main approaches to combine elastic substrates and conductive fillers.…”
mentioning
confidence: 99%