Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

Koshi, Tomoya; Nomura, Kohji; Yoshida, Minoru

doi:10.3390/mi11020209

Cited by 26 publications

(27 citation statements)

References 27 publications

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“…Soldering achieves good electrical contact [ 84 ]. The integration of the electronics on to textile substrate by soldering can usually be achieved by direct contact or frictional soldering [ 85 ], hot air or thermal soldering [ 86 ], ultrasonic soldering [ 87 , 88 ], laser soldering [ 89 ], and infrared soldering [ 90 ] as shown in Figure 3 [ 91 ].…”

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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“…Additionally, shearing forces were applied on the overhanging resistors. The soldered connections again showed the best durability [ 86 ].…”

Section: Accelerated Functional Ageingmentioning

confidence: 99%

Towards the Functional Ageing of Electrically Conductive and Sensing Textiles: A Review

Biermaier

Bechtold

Pham

2021

Sensors

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Electronic textiles (e-textiles) have become more and more important in daily life and attracted increased attention of the scientific community over the last decade. This interdisciplinary field of interest ranges from material science, over chemistry, physics, electrical engineering, information technology to textile design. Numerous applications can already be found in sports, safety, healthcare, etc. Throughout the life of service, e-textiles undergo several exposures, e.g., mechanical stress, chemical corrosion, etc., that cause aging and functional losses in the materials. The review provides a broad and critical overview on the functional ageing of electronic textiles on different levels from fibres to fabrics. The main objective is to review possible aging mechanisms and elaborate the effect of aging on (electrical) performances of e-textiles. The review also provides an overview on different laboratory methods for the investigation on accelerated functional ageing. Finally, we try to build a model of cumulative fatigue damage theory for modelling the change of e-textile properties in their lifetime.

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“…Soldering achieves good electrical contact [78]. The integration of the electronics on to textile substrate by soldering can be usually achieved by direct contact or frictional soldering [79], hot air or thermal soldering [80], ultrasonic soldering [81,82] , laser soldering [83] and infrared soldering [84]. Mostly, for textile materials, thermal bonding and ultrasonic soldering have been used.…”

Section: Solderingmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

Cited by 26 publications

References 27 publications

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-Textile

Towards the Functional Ageing of Electrically Conductive and Sensing Textiles: A Review

Review on the Integration of Microelectronics for E-textile

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