Enhancing the Axial Ratio Bandwidth of Circularly Polarized Open Ground Slot CPW-Fed Antenna for Multiband Wireless Communications

Optimizing Electromagnetic Interference Shielding of Ultrathin Nanoheterostructure Textiles through Interfacial Engineering

“…The rapid developments of wireless communication technologies such as telecommunications and underwater communications − lead to increasing concerns on the issue of electromagnetic pollution, which is becoming a serious global problem. − The exposure of electronic devices to strong electromagnetic fields may cause the failure and degradation of electronic devices, and the created electromagnetic radiation will even threaten human health. To avoid the hazard of the electromagnetic interference (EMI), intensive research attention in material science has been paid to developing high-performance EMI shielding materials.…”

Enhancement of Isotropic Heat Dissipation of Polymer Composites by Using Ternary Filler Systems Consisting of Boron Nitride Nanotubes, h-BN, and Al2O3

“…As we approach the fifth-generation (5G) network era, current electronic devices adapt alongside this progressing technology. − However, the advances toward high speed, integrability, and portability in these devices result in the densification of the integrated circuit (IC) distribution, resulting in thermal challenges. Much attention has been invested in heat control advancement to resolve the thermal throttling effect on these electronic devices and systems, since the accumulated heat in these microelectronics hampers their performance, reliability, and life span.…”

A Facile Way of Enhancing Thermal Conduction in Epoxy-Based Nanocomposites via Construction of Well-Defined Hybrid Filler Networks Using a Magnetic Field

“…With the major innovation of modern electronic devices and communication cutting-edge technology, people have put forward high requirements for the portability and universality of the fifth generation electronic products, and the high-speed electronic components will undoubtedly release lots of heat and electromagnetic waves in a small space, which become the bottleneck restricting their further development. − Therefore, the materials manufacturing of electromagnetic shielding and thermally conductive fillers with strong attenuation ability, good thermal conductivity, and excellent mechanical stability has become a top priority. As is well-known, the electrical conductive property of composite systems is a key to the determination of the shielding efficiency based on the excellent bonding and electrical insulation properties of epoxy (EP) resin, − and the addition of a high-performance nanofiller can accelerate its heat transfer efficiency and electromagnetic interference shielding effectiveness (EMI SE).…”