Enhancing the adhesion of diamond films on cobalt-cemented tungsten carbide substrate using tungsten particles via MPCVD system

Lai, Wen Chi; Wu, Yu-Shiang; Chang, Hou-Cheng; Lee, Yuan-Haun

doi:10.1016/j.jallcom.2011.01.149

Cited by 13 publications

(2 citation statements)

References 26 publications

(31 reference statements)

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“…A tungsten resistance placed in the substrate holder was used to control substrates temperature at chosen level, in the range of 700 °C to 900 °C. Adhesion tests of diamond films were performed in a Rockwell C indenter [17][18][19] . Applied loads ranged from 300 N to 700 N. Gradual variation of loads allowed measurement of critical loads supported by each diamond film 20 .…”

Section: Methodsmentioning

confidence: 99%

Influence of Boriding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates

et al. 2015

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This paper shows successful hindering of the negative effects of the cobalt binder in the process of coating WC-Co cutting tools with CVD diamond films. The strategy was creating a boron-rich layer on the surface of the WC-Co substrates as an interlayer to block Co migration. The traditional boriding technique was improved by preheating the salt powders and controlling the brittle region thickness in the substrate surface. These procedures produce a tougher surface for diamond growth. Adding CF 4 to the gas mixture also enhanced diamond adhesion to the surface. The adhesion of diamond films to WC-Co substrates was evaluated by indentation tests. Samples were characterized by Scanning Electron Microscopy (SEM), Energy Dispersive X-ray (EDX), X-ray Diffraction (XRD) and Raman Scattering Spectroscopy (RSS).

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Section: Methodsmentioning

confidence: 99%

Influence of Boriding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates

et al. 2015

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“…The surface treatment of stainless steel can significantly improve its wear and corrosion resistance. WC/Co cemented carbide has been applied on cutting tools, engine components subject to wear, spray nozzles and other mechanical components due to its high hardness, corrosion resistance and high temperature resistance [6,[17][18][19]. Nevertheless, the surface hardness of the WC/Co cemented carbide substrate is able to be further enhanced by nitride coatings, while at the same time, retaining the toughness of the bulk substrate.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Effect of the filament discharge current on the microstructure and performance of plasma-enhanced magnetron sputtered TiN coatings

Zhang

Zhou

Gao

et al. 2017

Journal of Alloys and Compounds

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Titanium nitride (TiN) coatings were synthesized by plasma-enhanced magnetron sputtering (PEMS) on 316L austenitic stainless steel and YG8 cemented carbide substrates. The plasma enhancement process involved the use of hot filaments as additional sources of electrons for the magnetron discharge. The structural, morphology, crystallinity, thickness, abrasion resistance and adhesion of the TiN coatings, as well as the nanohardness and Young's modulus were investigated at different filament discharge currents. The results showed that with increasing discharge current, the deposition rate of the coating decreased, the structural morphology of the TiN coatings became finer and denser and the columnar grain size decreased. The critical load for failure in scratch adhesion tests of the coatings on stainless steel and YG8 substrates were over 22 N and 141 N, respectively. The nanohardness and Young's modulus both improved significantly from 8 GPa and 200 GPa to 38 GPa and 500 GPa, respectively, after the discharge current increased from 6

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Adherent diamond film deposited on Cu substrate by carbon transport from nanodiamond buried under Pt interlayer

Liu¹,

Wei²,

Yu³

et al. 2013

Applied Surface Science

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Enhancing the adhesion of diamond films on cobalt-cemented tungsten carbide substrate using tungsten particles via MPCVD system

Cited by 13 publications

References 26 publications

Influence of Boriding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates

Influence of Boriding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates

Effect of the filament discharge current on the microstructure and performance of plasma-enhanced magnetron sputtered TiN coatings

Adherent diamond film deposited on Cu substrate by carbon transport from nanodiamond buried under Pt interlayer

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