Enhancing Performance of Thermoelectric Coolers Through the Application of Distributed Control

Harvey, R.D.; Walker, D. G.; Frampton, Kenneth D.

doi:10.1109/tcapt.2007.898376

Cited by 9 publications

(4 citation statements)

References 25 publications

(24 reference statements)

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“…Thermoelectric cooler(or TEC in abbreviation) can realize refrigeration or heating by changing the direction of current, and has the advantages of small volume, no need of refrigerant and moving parts, which is very convenient for the multi-parameter combined environmental test. The refrigeration coefficient of TEC is smaller than that of refrigeration compressor [6,7], but it has a heating coefficient larger than 1.0, which is very fit for heating.…”

Section: Structure Of Temperature Testing Systemmentioning

confidence: 94%

Design of Temperature Testing System in Multi-Parameter Combined Environmental Test

Shen

2012

AMM

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A novel design of a temperature test chamber in multi-parameter combined environmental test was introduced, in which thermoelectric coolers were adopted to achieve both high and low temperature. Multiple distributed actuators and temperature sensors were used for improving the evenness of the temperature field. A well performed cooling system for waste heat dissipating was designed based on air-cooled radiator and circulating water flow. A temperature control system based on PC and MCU with wireless communication modules was designed. The thermoelectric cooler was driving by H-bridge circuit, whose power was controlled by PWM signal. PID algorithm was applied and average temperature was adopted to be the controlled variable. Measurement and control software on the PC and MCU was analyzed and its flow diagram was given. Influenced by centrifugal acceleration, unevenness of the temperature field would increase. A fan was mounted at the bottom of the chamber to improve the evenness of the temperature field. The experiment results show that the temperature environment with other combined environment is realized in the test chamber based on the above technology.

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Section: Structure Of Temperature Testing Systemmentioning

confidence: 94%

Design of Temperature Testing System in Multi-Parameter Combined Environmental Test

Shen

2012

AMM

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“…The idea can be developed backward and consider whether it would be reasonable to use distributed control for the separated elements of TEC. This scheme would lead to the more efficient use of TEC and higher value for COP [16].…”

Section: A Steady-state Condition Simulationmentioning

confidence: 99%

Experimenting and Simulating Thermoelectric Cooling of an LED Module

Maaspuro

2015

Int. J. Onl. Eng.

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-Use of a thermoelectric component (TEC) for an LED module cooling will be studied. The issue will be approached by revealing the operation of a thermoelectric component known also as Peltier element, and the main equations describing its behaviour. An experimental setup including an LED module, a TEC, an heatsink and a fan will be build. Heat dissipation and the electrical performance measurements of the hole experimental setup will be conducted. The benefits and the limitations of TEC used in cooling, will be revealed. Cooling effect versus used electrical power will be studied. 3D thermal simulations for the experimental setup using a FEM simulation software will be presented. Alternatively, a standard circuit simulator will be used. A spice model, which imports TEC's parameters from the data sheet, will be developed. The spice simulation results are compared with the experimental results.

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“…Bell [14] has shown that individually controlling the current to the thermocouples in a TEM or individual TEMs in an array of them may increase efficiency when TEMs are used to transfer heat between two fluid streams. Moreover, Harvey et al [15] have shown that efficiency may be increased substantially by supplying the optimal current to each thermocouple in a TEM subjected to a non-uniform heat load with a specified maximum temperature. Additionally, Hodes [16] showed that for precision temperature control applications that, depending on operating conditions, require either Peltier cooling at the csi (where an efficient heat sink is of benefit) or Peltier heating at the csi (where a less efficient heat sink is optimal), judicious selection of heat sink thermal resistance can significantly reduce the maximum power consumption of a TEM.…”

Section: Enhancement Of Thermoelectric Refrigerationmentioning

confidence: 99%

Optimal Design of Thermoelectric Refrigerators Embedded in a Thermal Resistance Network

Brownell

Hodes

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Thermoelectric refrigeration offers advantages (e.g., no moving parts) over other refrigeration technologies. However, because maximum performance (i.e., heat load for a specified temperature drop below ambient temperature or vice versa) and efficiency (i.e., coefficient of performance) are relatively low, it is important to realize them. It is shown that the cross-sectional area of the semiconductor pellets in a thermoelectric module (TEM) operating in refrigeration mode does not affect its performance or efficiency, but may be sized to tune its operating current and voltage. Then, a procedure is provided to determine the height of the pellets which maximizes performance. Next, it is shown that a range of pellet heights accommodates a specified performance below the maximum one and a procedure is provided to compute that corresponding to maximum efficiency. A thermal resistance boundary condition is applied between the interface in a TEM where Peltier cooling occurs and the control point where it maintains the temperature of a component or medium below ambient temperature. Thermal resistance boundary conditions are also applied between the control point and its local ambient and the interface in a TEM where Peltier heating occurs and its local ambient. The analysis is generalized by using flux-based quantities where applicable and it accounts for the electrical contact resistance at the interconnects in a TEM. Implementation of the optimization procedures are illustrated and the ramifications of the results are discussed.

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Enhancing Performance of Thermoelectric Coolers Through the Application of Distributed Control

Cited by 9 publications

References 25 publications

Design of Temperature Testing System in Multi-Parameter Combined Environmental Test

Design of Temperature Testing System in Multi-Parameter Combined Environmental Test

Experimenting and Simulating Thermoelectric Cooling of an LED Module

Optimal Design of Thermoelectric Refrigerators Embedded in a Thermal Resistance Network

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