Optimal Design of Thermoelectric Refrigerators Embedded in a Thermal Resistance Network

Brownell, Elizabeth; Hodes, Marc

doi:10.1109/tcpmt.2011.2166762

Cited by 16 publications

(6 citation statements)

References 22 publications

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“…It is essential to characterize the heat sink resistance, as the performance of the TEM depends strongly on the heat sink performance [23]. In the present experiments, the heat transfer from the hot side (q h ) of the TEM corresponds to the heat transfer rate through the heat sink (q HS ).…”

Section: Heat Sink and Parasitic Heat Load Resistancesmentioning

confidence: 99%

Determination of Electrical Contact Resistivity in Thermoelectric Modules (TEMs) From Module-Level Measurements

Annapragada¹,

Salamon²,

Kolodner³

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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An experimental apparatus was developed to characterize the performance of a thermoelectric module (TEM) and heat sink assembly when the TEM was operated in refrigeration mode. A numerical model was developed to simulate the experiments.Bulk and interfacial Ohmic heating, the Peltier effect, Thomson effect and temperature-dependent bulk material properties, i.e., Seebeck coefficient and electrical conductivity were considered. A novel, self-consistent characterization methodology was developed to obtain the electrical contact resistivity at the interconnects in a TEM from the numerical simulations and the experiments. The electrical contact resistivity of the module tested was determined to be approximately 1.0×10 -9 Ωm 2 . The predictions are consistent with electrical contact resistivity obtained based on the performance specifications (ΔT max ) of the TEM.

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Section: Heat Sink and Parasitic Heat Load Resistancesmentioning

confidence: 99%

Determination of Electrical Contact Resistivity in Thermoelectric Modules (TEMs) From Module-Level Measurements

Annapragada¹,

Salamon²,

Kolodner³

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…(4) where Gxy (Tx Ty) is the conduction heat flux between the upper and lower plates the TEM and Px and Py the powers heat active, given by. (5) for which Rxy is the electrical resistance between the upper and lower plates of the TEM [in Ohm] and Ks is the coefficient from seebeck [in V K -1 ]. The term is related to TEM heating by the Joule effect.…”

Section: Thermal Camera Dynamics Modelmentioning

confidence: 99%

“…In the outer loop, a temperature controller CT(z) is designed in such a way to guarantee the desired temperature in the TEM. The TEM module is composed of Pxy that represents the nonlinear part described in equation (5). The temperature sensor used has a finite response time and transfer function given by.…”

Section: A Controller Projectmentioning

confidence: 99%

“…To have an adequate control of the temperature in the TEM, it is necessary to have a control of the current that passes through the TEM. The TEM structure has been widely discussed in the literature [5] and [10]. as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…1, the device is composed of several semiconductors electrically connected in series and sandwiched between two plates of ceramics. When connected to a DC power supply, current flows through the elements producing the pumping heat from one side to the other [5] and [2]. As a consequence, this creates a side hot and a cold side.…”

Section: Introductionmentioning

confidence: 99%

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Analysis of Temperature Controller in Thermal Chambers for Arbitrary References

Lerma Coaquira,

Chayña Velasquez,

Chura Acero

et al. 2023

Proceedings of the 21th LACCEI International Multi-Conference for Engineering, Education and Technology (LACCEI 2023): “Leaders

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The temperature control of a thermoelectric module used in the construction of thermal cameras for the characterization of materials is proposed, including smart materials such as shape memory alloys, among others. A current amplifier controller model is used together with the corresponding model of the thermoelectric module and the thermal camera. This set is considered as a non-linear load with a variable impedance that must be controlled. In order to achieve effective temperature control, a temperature controller is implemented in the thermoelectric module designed in closed loop, thus ensuring the maintenance of the desired temperature. To measure the temperature in the thermoelectric module or in the chamber, a thermistor type sensor is used due to its fast response compared to other types of sensors. In the analysis of the temperature controller, various disturbances are taken into account, such as the ambient temperature that can vary between 15 and 35 degrees Celsius, the temperature range of the system between -10 and 100 degrees Celsius, the possibility of varying the impedance of the thermoelectric module, the delays produced in the thermistor response and the effect of the heat sink on the cooling temperature. A stability analysis is carried out for the temperature controller of the system in discrete time using the Root Locus method. The results of the transient response analysis demonstrate the effectiveness of the proposed controller. Simulations are presented showing how the system can cope with sudden or arbitrary temperature variations, and even follow sinusoidal references. Thisshows that it is possible to satisfactorily control the assembly consisting of the amplifier, the thermoelectric module and the thermal camera.

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