An AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor ͑pHEMT͒ with double ␦-doping carrier supply layers was fabricated and characterized. Estimates of typical device characteristics ͑extrinsic transconductance ͑g m ͒, drain current density ͑I D ͒, threshold voltage ͑V th ͒, current gain cut-off frequency ͑ f T ͒, maximum frequency of oscillation ͑ f max ͒, noise behavior, and large signal measurements͒ were made. A series of experiments was conducted to assess the effects of temperature on pHEMT. A peak g m of 161 mS/mm was obtained from the fabricated pHEMT with a gate length of 1 m for room-temperature operation. The transistor characteristics showed evidence of high breakdown voltages. With respect to the variation in two-terminal gatedrain breakdown voltage, this device had a positive temperature coefficient from 300 to 450 K, and a negative temperature coefficient at temperatures surpassing 450 K. Strikingly, high-frequency on-wafer measurements on the fabricated pHEMT were made up to 400 K, revealing nearly no change in f T . Not only was the device characterized and the complicated mechanisms at various temperatures elucidated, but also the favorable potential of the presented pHEMT for high-temperature and high-frequency applications was determined.