Enhanced through-plane thermal conductivity and high electrical insulation of flexible composite films with aligned boron nitride for thermal interface material

Song, Qingsong; Zhu, Wei; Deng, Yuan; Hai, Fengxun; Wang, Yaling; Guo, Zhanpeng

doi:10.1016/j.compositesa.2019.105654

Cited by 64 publications

(21 citation statements)

References 41 publications

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“…is an effective way to reduce the phonon scattering caused by the filler-filler interface by designing the microstructure of composite and constructing an interconnected network of fillers as a heat conduction pathway [ 52 ]. In recent years, various approaches including vacuum-assisted layer-by-layer self-assembly [ 72 ], ice-templating self-assembly [ 73 , 74 ], chemical vapor deposition (CVD) [ 75 ], 3D printing [ 76 , 77 , 78 ], electrospinning [ 6 , 79 ], mold pressing [ 66 , 80 ], etc., have been reported to build interconnected filler networks ( Figure 6 ). Vacuum-assisted layer-by-layer self-assembly is a process of solid–liquid separation driven by negative pressure.…”

Section: Thermally Conductive Polymer Compositesmentioning

confidence: 99%

“…Therefore, increasing the thermal conductivity, especially through-plane thermal conductivity, is to accelerate longitudinal heat transfer and reduce the air layer at interfaces (the thermal conductivity of air layer is as low as 0.02 Wm −1 K −1 ) is the key to decrease the R value for achieving efficient heat dissipation. Flexible polymer-based composites could fit well with devices, so the above-discussed high through-plane thermally conductive polymer composite is a promising candidate for serving as TIM to realize the thermal management of electronic devices, such as POE/BN composites [ 66 ] with the through-plane thermal conductivity of 6.94 Wm −1 K −1 , AgNPs@BC/Al 2 O 3 /GNPs composites [ 47 ] with the through-plane thermal conductivity of 9.09 Wm −1 K −1 , graphene/PU composites with the through-plane thermal conductivity of 12 Wm −1 K −1 [ 86 ], BN/poly (vinylidene fluoride) composites [ 80 ] with the through-plane thermal conductivity of 3.5 Wm −1 K −1 , EG/epoxy composites with the through-plane thermal conductivity of 4.14 Wm −1 K −1 [ 49 ], etc.…”

Section: Thermal Management Applicationsmentioning

confidence: 99%

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Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Zhang

Shi

2021

Polymers

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The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

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Section: Thermally Conductive Polymer Compositesmentioning

confidence: 99%

Section: Thermal Management Applicationsmentioning

confidence: 99%

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Zhang

Shi

2021

Polymers

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“…[10][11][12][13] Most of the studies BN added into epoxy aimed to improve thermal or mechanical properties of composites. [14][15][16][17][18][19] The reinforcement of epoxy with nanoparticles lead to an improvement in several properties. On the other hand, some cases have some limitations for these improvements such as the particles not fully adhering to the polymer matrix or not dispersing by clumping.…”

Section: Introductionmentioning

confidence: 99%

Improvements of the structural, thermal, and mechanical properties of structural adhesive with functionalized boron nitride nanoparticles

Gülteki̇n

Uğuz

Özel

2021

J of Applied Polymer Sci

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Investigations on the production and development of nanoparticle-reinforced polymer materials have been attracted attention by researchers. Various nanoparticles have been used to improve the mechanical, chemical, thermal, and physical properties of polymer matrix composites. Boron compounds come to the fore to improve the mechanical and thermal properties of polymers. In this study, mechanical, thermal, and structural properties of structural adhesive have been examined by adding nano hexagonal boron nitride (h-BN) to epoxy matrix at different percentages (0.5, 1, 2, 3, 4, and 5%). For this purpose, nano h-BN particles were functionalized with 3-aminopropyltriethoxysilane (APTES) to disperse the h-BN nanoparticles homogeneously in epoxy matrix and to form a strong bond at the matrix interface. Two-component structural epoxy adhesive was modified by using functionalized h-BN nanoparticles. The structural and thermal properties of the modified adhesives were investigated by scanning electron microscopy and energy dispersion X-ray spectroscopy, Fourier transform infrared spectroscopy, differential scanning calorimetry, and thermogravimetric analysis techniques. Tensile test and dynamic mechanical analysis were performed to determine the mechanical properties of the adhesives. When the results obtained from analysis were examined, it was seen that the nano h-BN particles functionalized with APTES were homogeneously dispersed in the epoxy matrix and formed a strong bond. In addition that, it was concluded from the experimental results that the thermal and mechanical properties of adhesives were improved by adding functionalized nano h-BN particles into epoxy at different ratios.

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“…It possesses remarkable properties such as excellent electrical insulation, hydrophobicity, chemical inertness and high tolerance to various radiations, except for a low thermal conductivity (about 0.125~0.25 W (m -1 K -1 )) [11,12]. Currently, the thermal conductivity of electronic packaging polymers can be enhanced by filling high thermal conductivity and electrical insulating ceramic particles [13][14][15], such as aluminum nitride (AlN) [16], boron nitride (BN) [17], SiC [18], Si 3 N 4 [19]. For example, Yang et al proposed to modify the surface of AlN powder by atmospheric pressure plasma method.…”

Section: Introductionmentioning

confidence: 99%

Study on aluminum nitride/addition-cure liquid silicone rubber composite for high-voltage power encapsulation

Gao

Zhu

et al. 2021

PLoS ONE

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In view of the development direction of high power and miniaturization of high-voltage power supply, higher requirements are put forward for the breakdown strength, thermal conductivity of packaging materials for its high voltage output module. An electric-insulated heat-conducted material with aluminium nitride as heat conducting filler and addition-cure liquid silicone rubber (ALSR) as matrix for high voltage power encapsulation has been studied. Initially, the thermal conductivity and breakdown strength of composites were explored at different filler fractions. With increase of filler fraction, the thermal conductivity increased and the breakdown strength decreased. Then, with the packaging module volume as the optimization objective and the working temperature as the optimization condition, the temperature distribution of high voltage power supply was studied by using the finite element method, and 40wt% filling fraction was selected as the optimal ratio. Finally, the actual packaging experiment of the high voltage module is carried out. and the variation of the output voltage and temperature with the working time is obtained. According to the experimental results, the output voltage of the high voltage module is basically stable, and the maximum surface temperature is 40.4°C. The practicability of the electric-insulated heat-conducted material has been proved.

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Enhanced through-plane thermal conductivity and high electrical insulation of flexible composite films with aligned boron nitride for thermal interface material

Cited by 64 publications

References 41 publications

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Improvements of the structural, thermal, and mechanical properties of structural adhesive with functionalized boron nitride nanoparticles

Study on aluminum nitride/addition-cure liquid silicone rubber composite for high-voltage power encapsulation

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