2012
DOI: 10.1109/tcpmt.2012.2219622
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Enhanced Thermal Performance of InGaP/GaAs Collector-Up HBTs With a Miniaturized Backside Heat-Dissipation Structure

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Cited by 2 publications
(1 citation statement)
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“…In today's growing demand for wireless communications and the explosive growth of high-speed commercial applications, GaAs technology is widely accepted as a main technology for producing high-power, high-frequency, and low-noise products for these applications [2]. The GaAs substrate is a relatively poor thermal conductor, and the internal III-V ternary compound materials of the HBT structure possess thermal conductivities an order of magnitude lower than that for GaAs [3]. These factors lead to aggravated thermal issues that may not only degrade the device performance but also impact the device reliability.…”
Section: Introductionmentioning
confidence: 99%
“…In today's growing demand for wireless communications and the explosive growth of high-speed commercial applications, GaAs technology is widely accepted as a main technology for producing high-power, high-frequency, and low-noise products for these applications [2]. The GaAs substrate is a relatively poor thermal conductor, and the internal III-V ternary compound materials of the HBT structure possess thermal conductivities an order of magnitude lower than that for GaAs [3]. These factors lead to aggravated thermal issues that may not only degrade the device performance but also impact the device reliability.…”
Section: Introductionmentioning
confidence: 99%