Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Shen, Dianyu; Zhan, Zhaolin; Liu, Zhiduo; Cao, Yong; Zhou, Li; Liu, Yuanli; Dai, Wen; Nishimura, Kazuhito; Li, Chaoyang; Lin, Cheng‐Te; Jiang, Nan; Yu, Jinhong

doi:10.1038/s41598-017-02929-0

Cited by 120 publications

(61 citation statements)

References 75 publications

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“…The filler content is the most frequently discussed influential factor, and only a very few studies have explored the temperature influence. A recent work shows that the κ of epoxy composites containing 3 wt% of SiC NWs increases with temperature . Figure b summarizes the thermal conductivity of polymer composites reinforced by different ceramic nanofillers.…”

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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This work summarizes the recent progress on the thermal transport properties of 3D nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or designed to either achieve a low thermal conductivity for thermal insulation or thermoelectric devices or a high thermal conductivity for thermal interface materials used in the continuing miniaturization of electronics. A broad range of 3D nanostructures are discussed, ranging from colloidal crystals/assemblies, array structures, holey structures, hierarchical structures, to 3D nanostructured fillers for metal matrix composites and polymer composites. Different factors that impact the thermal conductivity of these 3D structures are compared and analyzed. This work provides an overall understanding of the thermal transport properties of various 3D nanostructures, which will shed light on the thermal management at nanoscale.

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Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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“…Gu et al [26,27] fabricated the corresponding thermally conductive SiC/PS composites by the method of Belectrospinning-laminating-hot press.T he addition of 32.8 vol% SiCp could improve the λ value of pure PS from 0.182 to 0.566 W/mK. Shen et al [173] reported a facile approach to fabricate epoxy composites incorporated with silicon carbide nanowires (SiC NWs) and silicon carbide micron particles (SiC MPs), respectively. The λ value of the SiC NWs/epoxy composite was increased to 0.449 W/mK with 3.0 wt% SiC NWs, higher than that of the SiC MPs/epoxy composite filled with the same addition of SiC MPs.…”

Section: Sicmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

294

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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“…The thermal conductivity obtained for the thermal interface materials also agrees with that measured using the in-house steady-state divided bar method (Nanotest TIMA). The relative [26] 0.04 ± 0.03 0.068 [26], [27], [28] PDMS 0.15 ± 0.01 0.16 [41], 0.26 [42], 0.21 [43] 0.06 ± 0.01 -Epoxy (cured) 0.22 ± 0.02 0.23 ± 0.02 [*], 0.2 [44], [45] 0.11 ± 0.03 0.06-0.24 [45], [46] Glycerol 0.27 ± 0.01 0.285 [47] 0.06 ± 0.03 0.099 [29]…”

Section: -Omega Measurement Results For Reference Materialsmentioning

confidence: 99%

Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples

Grosse

Ras

Varpula

et al. 2018

Sensors and Actuators A: Physical

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A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the bidirectional 3-omega method. The platform is composed of glass substrates on which sensor structures and a very thin dielectric nanolaminate passivation layer are fabricated. Using through-glass vias for contacting the sensors from the chip back side leaves the top side of the platform free for deposition, manipulation and optical inspection of the sample during 3-omega measurements. The thin passivation layer, which is deposited by atomic layer deposition on the platform surface, provides superior chemical resistance and allows for the measurement of electrically conductive samples, while maintaining the conditions for a simple thermal analysis. We demonstrate the measurement of thermal conductivities of borosilicate glass, pure water, glycerol, 2propanol, PDMS, cured epoxy, and heat-sink compounds. The results compare well with both literature values and values obtained with the steady-state divided bar method. Small sample volumes (~0.02 mm³) suffice for accurate measurements using the platform, allowing rapid temperaturedependent measurements of thermal properties, which can be useful for the development, optimization and quality testing of many materials, such as liquids, gels, pastes and solids.

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Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Cited by 120 publications

References 75 publications

Thermal Transport in 3D Nanostructures

Thermal Transport in 3D Nanostructures

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples

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