Enhanced thermal conductivity and retained electrical insulation of epoxy composites filled with Cu@BaTiO3 core–shell particles

Wang, Zelong; Hou, Dajun; Yi, Jungang; Cai, Ning; Guo, Jia

doi:10.1016/j.matlet.2021.130840

Cited by 8 publications

(2 citation statements)

References 14 publications

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“…Epoxy resins have excellent electrical insulation properties, outstanding corrosion resistance, good dimensional and thermal stabilities, as well as high mechanical properties; these materials are widely used in the packaging of electronic devices 6–10 . However, they also exhibit low intrinsic thermal conductivity, owing to the amorphous arrangement of the epoxy molecular chains, which limits their application as thermally conductive materials 11–14 …”

Section: Introductionmentioning

confidence: 99%

“…[6][7][8][9][10] However, they also exhibit low intrinsic thermal conductivity, owing to the amorphous arrangement of the epoxy molecular chains, which limits their application as thermally conductive materials. [11][12][13][14] N-Benzylpyrazinium hexafluoroantimonate (BPH) is a cationic thermally latent initiator of epoxy resins, which is inert at room temperature. Figure 1 shows the curing mechanism of epoxy resins initiated by BPH.…”

Section: Introductionmentioning

confidence: 99%

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Improved thermal conductivity of epoxy resins using silane coupling agent‐modified expanded graphite

Jiang

Chu

Zhang

et al. 2022

J of Applied Polymer Sci

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A silane coupling agent was used to modify the surface of expanded graphite (EG), which was subsequently used as a thermally conductive filler to fabricate diglycidylether of bisphenol-A (DGEBA)/EG composites with high thermal conductivity via hot blending and compression-curing processes. The surface characteristics of silane coupling agent-modified EG (Si@EG) were characterized by a variety of analytical techniques. The effects of the Si@EG content on the thermal conductivity, thermal stability, impact strength, and morphology of the DGEBA/Si@EG composites were investigated. The results revealed that the addition of 80 wt.% Si@EG increased the thermal conductivity of the composites from 0.17 to 10.56 W/m K, which was 61.1 times higher than that of pristine DGEBA. The initial decomposition temperature of the composite containing 80 wt.% Si@EG was 60.6 C higher than that of pristine DGEBA. The impact strength of the composites decreased from 2.0 to 0.87 kJ/m 2 when the Si@EG content increased from 0 to 80 wt.%. The scanning electron microscopy images of the fractured surfaces revealed that the EG sheets in the DGEBA matrix formed a continuous thermally conductive path at high Si@EG contents.

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Section: Introductionmentioning

confidence: 99%