Recent advances in thermal-conductive insulating polymer composites with various fillers

Chen, Qingguo; Yang, Kailun; Feng, Yu; Liang, Liang; Chi, Minghe; Zhang, Zhonghua; Chen, Xuesong

doi:10.1016/j.compositesa.2023.107998

Cited by 17 publications

(3 citation statements)

References 276 publications

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“…superior thermal conductivity [53][54][55]. By enhancing these two factors, the mean free pathway of phonons is extended, minimizing phonon scattering and ultimately improving the thermal conductivity of the composite [56].…”

Section: Vitrimer-assisted Filler Orientation For the Highly Thermal ...mentioning

confidence: 99%

“…Polymer-based thermally conductive composite materials are fabricated with polymer (matrix) and high thermal conductive ceramic material (filler), as shown in Figure 2. Utilizing polymer composites with high crosslinking density and oriented fillers is an effective strategy for producing composites with superior thermal conductivity [53][54][55]. By enhancing these two factors, the mean free pathway of phonons is extended, minimizing phonon scattering and ultimately improving the thermal conductivity of the composite [56].…”

Section: Introductionmentioning

confidence: 99%

“…By enhancing these two factors, the mean free pathway of phonons is extended, minimizing phonon scattering and ultimately improving the thermal conductivity of the composite [56]. superior thermal conductivity [53][54][55]. By enhancing these two factors, the mean free pathway of phonons is extended, minimizing phonon scattering and ultimately improving the thermal conductivity of the composite [56].…”

Section: Introductionmentioning

confidence: 99%

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Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Hong,

Goh

2024

Polymers

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Vitrimers, as dynamic covalent network polymers, represent a groundbreaking advancement in materials science. They excel in their applications, such as advanced thermal-conductivity composite materials, providing a sustainable alternative to traditional polymers. The incorporation of vitrimers into composite fillers enhances alignment and heat passway broadly, resulting in superior thermal conductivity compared to conventional thermosetting polymers. Their dynamic exchange reactions enable straightforward reprocessing, fostering the easy reuse of damaged composite materials and opening possibilities for recycling both matrix and filler components. We review an overview of the present advancements in utilizing vitrimers for highly thermally conductive composite materials.

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Section: Vitrimer-assisted Filler Orientation For the Highly Thermal ...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Hong,

Goh

2024

Polymers

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Improvement of thermal, mechanical, and electromagnetic interference shielding properties of polyethylene nanocomposites by introducing non‐covalently modified carbon nanotube and reactive polyethylene copolymer

Tang,

Song,

Park

et al. 2024

Polymer Composites

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We herein report the enhancement of thermal, electrical, electromagnetic interference (EMI) shielding, and mechanical performance of polyethylene (PE) nanocomposites by the introduction of non‐covalently modified multi‐walled carbon nanotube (MWCNT) and ethylene‐glycidyl methacrylate (EGMA) copolymer. For this purpose, benzylacetic acid‐functionalized MWCNT (BA‐M) is prepared by ball milling, and it is melt‐mixed with EGMA to prepare a masterbatch. The masterbatch is then melt‐compounded with neat PE to manufacture a series of PE/EGMA/BA‐M nanocomposites with 0.5–5 wt% MWCNTs. Electron microscopic and spectroscopic analyses confirm the successful fabrication of non‐covalently functionalized BA‐M, the uniform dispersity of MWCNTs in the PE matrix, and the chemical reactions between the carboxylic acid groups of BA‐M and the epoxy group of EGMA in the nanocomposites. Scanning calorimetric data reveals that BA‐M acts as an efficient nucleating agent for the crystallization of PE. The excellent dispersity and robust interfacial bonding of BA‐M in the PE matrix result in improved electrical and EMI shielding properties in PE/EGMA/BA‐M nanocomposites. Furthermore, the tensile strength, initial modulus, and impact strength of the nanocomposites gradually rise as the BA‐M content increases. Thus, the PE/EGMA/BA‐M nanocomposite containing 5 wt% MWCNT achieves excellent performance of EMI shielding effectiveness of ~14.7 dB/mm, tensile strength of ~34.5 MPa, initial modulus of ~295.7 MPa, and impact strength of ~539.9 J/m, which represent enhancements of ~265%, ~40%, ~82%, and ~452%, respectively, compared to pristine PE.Highlights Non‐covalently modified MWCNT (BA‐M) was prepared by facile ball milling. PE nanocomposites with BA‐M and EGMA were prepared by masterbatch melt‐mixing. Excellent dispersity and interfacial bonding of MWCNT in the PE matrix were attained. Tensile strength and initial modulus of the nanocomposites were highly improved. EMI shielding effectiveness of the nanocomposite with 5 wt% MWCNT was ~14.7 dB/mm.

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Dimethyl sulfoxide dispersion of aramid nanofibers: An excellent medium for exfoliating high-quality boron nitride nanosheets towards heat spreading films with high thermal conductivity

Liu,

Huang

et al. 2024

Ceramics International

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Recent advances in thermal-conductive insulating polymer composites with various fillers

Cited by 17 publications

References 276 publications

Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Improvement of thermal, mechanical, and electromagnetic interference shielding properties of polyethylene nanocomposites by introducing non‐covalently modified carbon nanotube and reactive polyethylene copolymer

Dimethyl sulfoxide dispersion of aramid nanofibers: An excellent medium for exfoliating high-quality boron nitride nanosheets towards heat spreading films with high thermal conductivity

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